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Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior

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Abstract

In this work, brazing of porous copper foam (PCF) to copper (Cu) using amorphous Cu-9.7Sn-5.7Ni-7.0P (in weight, wt%) filler metal has been performed. PCF with different pore densities of 15 pore per inch (PPI), 25 PPI, and 50 PPI were sandwiched in between amorphous Cu-9.7Sn-5.7Ni-7.0P filler/Cu based plate. A brazed joint of Cu/Cu using amorphous Cu-9.7Sn-5.7Ni-7.0P filler was prepared for comparison purposes. The interfacial microstructures and mechanical properties of the brazed joint were investigated to study the joint ability after the brazing process. Scanning electron microscope (SEM) confirmed the interfacial microstructure by the formation of the diffusion layer (shown in light shaded area) and filler layer (gray island-shaped) for both Cu/Cu and Cu/PCF/Cu brazed joint. The X-ray diffraction (XRD) patterns identified the brittle phases of Cu3P and Ni3P, Cu and Cu6Sn5 phases at the diffusion layer. In the shear test, the strength value decreases with increase in the pore densities of PCF. The decreasing shear strength observed with an increase in the number of PPI in PCF is due to the formation of more cavities in Cu/PCF as the number of PPI in Cu/PCF increases.

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Funding

This work received financial support from the Fundamental Research Grant Scheme, FRGS University of Malaya under (Project number FP062-2015A), Research Universities, RU University of Malaya under (Project number ST006-2018), and equipments service contribution in Nagaoka University of Technology (Niigata, Japan).

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Authors and Affiliations

  1. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Nur Amirah Mohd Zahri, Farazila Yusof, A. S. Md.Abdul Haseeb & Nazatul Liana Sukiman

  2. Centre of Advanced Manufacturing & Material Processing (AMMP Centre), Faculty of Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    Farazila Yusof

  3. Department of Mechanical Engineering, Nagaoka University of Technology, Nagaoka, 940-2188, Japan

    Yukio Miyashita

  4. Department of Metallurgical Engineering, Tokai University, Hiratsuka, 259-1292, Japan

    Tadashi Ariga

  5. Centre for Materials Engineering and Smart Manufacturing (MERCU), Faculty of Engineering and Built Environment, Universiti Kebangsaan Malaysia, 43000, Bandar Baru Bangi, Selangor, Malaysia

    Nashrah Hani Jamadon

Authors
  1. Nur Amirah Mohd Zahri
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  2. Farazila Yusof
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  3. Yukio Miyashita
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  4. Tadashi Ariga
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  5. A. S. Md.Abdul Haseeb
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  6. Nashrah Hani Jamadon
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  7. Nazatul Liana Sukiman
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Correspondence to Farazila Yusof.

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Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Zahri, N.A.M., Yusof, F., Miyashita, Y. et al. Brazing of porous copper foam/copper with amorphous Cu-9.7Sn-5.7Ni-7.0P (wt%) filler metal: interfacial microstructure and diffusion behavior. Weld World 64, 209–217 (2020). https://doi.org/10.1007/s40194-019-00804-2

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  • DOI: https://doi.org/10.1007/s40194-019-00804-2

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