Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder

Abstract

This work deals with the study of ultrasonic soldering of SiC ceramics by use of Zn-Al-In solder destined for higher application temperatures. The structure and properties of this soldering alloy were assessed. The Zn5Al1In solder consists of βZn matrix, where the βZn + αAl a (In) eutectics in the form of oblong and spherical clusters are non-uniformly distributed. The tensile strength of soldering alloy attained the value of 52 MPa. The soldered joint of SiC/Zn5Al1In/SiC was fabricated at the temperature of 420 °C at simultaneous acting of ultrasonic vibrations. The bond was formed owing to the formation of two new thin layers of Al + Si and Zn + C on the surface of SiC substrate. The average shear strength of SiC/Zn5Al1In/SiC joint attained 49 MPa. The fracture has occurred not only in the solder bulk but also in a close vicinity of SiC substrate. In this zone, similarly as on the fractured surface in the solder zone, the presence of In was identified, in which a considerable measure affected the resultant strength values.

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Acknowledgements

The authors thank Assoc. Prof. Ing. Viliam Hrnčiar, CSc. for the EDX analysis.

Funding

This work was supported by the Slovak Research and Development Agency under the contract no. APVV-17-0025. The paper was prepared also with the support of the VEGA 1/0089/17 project: Research of new alloys for direct soldering of metallic and ceramic materials.

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Correspondence to Igor Kostolný.

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Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Kostolný, I., Koleňák, R., Hodúlová, E. et al. Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder. Weld World 63, 1449–1459 (2019). https://doi.org/10.1007/s40194-019-00758-5

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Keywords

  • SiC ceramics
  • Ultrasound
  • Higher application temperatures
  • Shear strength