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Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface

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A Publisher Correction to this article was published on 12 July 2018

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Abstract

Properties of lead-free solder alloys and microstructural characterization of solder joints made from Sn1.0Ag0.5Cu1.0Bi and Sn0.9Ag0.5Cu0.9Bi1.0In (composition given in weight %) with Cu plate were widely studied in this work. The influence of Bi and In additions in these solder alloys was studied as well. The melting temperatures, diffluence and wetting properties, microstructures and costs were observed and evaluated. Thermo-Calc software was used for phase composition prediction. Altogether, 1500 cycles were carried out for the thermal cycling test in the range from +150 to −40 °C where the solder joints’ reliability was assessed due to practice requirement. Optical microscopy, scanning electron microscopy (EDX microanalysis) and shear strength test were used for the evolution of microstructure, structural integrity and mechanical strength of thermal-cycled solder joints. The reliability test results after temperature cycling indicate two lead-free solder alloys as the most convenient for soldering in the microelectronics industry.

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  • 12 July 2018

    In the original version of this article, the data displayed online in the “About this article” section for “Cite this article as:...,” the first and second name of the second author are incorrect.

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Acknowledgments

This research is supported by VEGA Grant No. 1/0455/14, Grant No. APVV-0023/12 and OP for project Centre of Excellence of Five-axis Machining Experimental Base for High Tech Research ITMS 26220120045 and co-financed the by European Funds for Regional Development.

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Authors and Affiliations

  1. Materials Science and Technology in Trnava, Institute of Production Technologies, Slovak University of Technology in Bratislava, Bratislava, Slovak Republic

    Šimeková Beáta, Hodúlová Erika & Kovaříková Ingrid

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  1. Šimeková Beáta
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  2. Hodúlová Erika
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  3. Kovaříková Ingrid
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Correspondence to Hodúlová Erika.

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Recommended for publication by Commission XVII - Brazing, Soldering and Diffusion Bonding

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Beáta, Š., Erika, H. & Ingrid, K. Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface. Weld World 61, 613–621 (2017). https://doi.org/10.1007/s40194-017-0446-9

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  • DOI: https://doi.org/10.1007/s40194-017-0446-9

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