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Joining of SiO2f/SiO2 composite to Al2O3 ceramic using AgCu-Ti brazing filler metal

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Abstract

SiO2f/SiO2 composite was joined to Al2O3 ceramic using AgCu-Ti active filler at brazing temperature of 1153 K for 10 and 60 min, respectively, and sound joints were achieved. It was found that a thin reaction layer had been formed close to each of the joined materials, and the brazing seam matrix was composed of homogeneous Ag-Cu eutectic alloy. The joint interface was analyzed by SEM, EDS, and XRD. The typical interface structure of joint brazed at 1153 K for 10 min could be described as the following sequence: SiO2f/SiO2 → TiO2 + Ti5Si4 → TiO2 + Cu3Ti3O → Ag-Cu eutectic alloy → (Ti-O) + (Ti-Cu-O) → Al2O3. However, Cu2Ti4O but not Cu3Ti3O was detected in the joints brazed at 1153 K for 60 min. Besides, the reaction layers of joint brazed at 1153 K for 60 min were much thicker than those for 10 min. The SiO2f/SiO2-Al2O3 joints brazed at 1153 K for 10 min showed an average shear strength of 38.6 MPa, evidently higher than that (26.0MPa) brazed at 1153 K for 60 min.

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Acknowledgments

This research work is sponsored by the National Natural Science Foundation of China (Contract nos. 5990522, 50475160, 51275497, and 5140105004).

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Authors and Affiliations

  1. Laboratory of Welding and Forging, Beijing Institute of Aeronautical Materials, P. O. Box 81-20, Beijing, 100095, People’s Republic of China

    Shi-Biao Wu, Hua-Ping Xiong, Bo Chen & Yao-Yong Cheng

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  1. Shi-Biao Wu
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  2. Hua-Ping Xiong
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  3. Bo Chen
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  4. Yao-Yong Cheng
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Corresponding author

Correspondence to Hua-Ping Xiong.

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Recommended for publication by Commission XVII -Brazing, Soldering and Diffusion Bonding

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Wu, SB., Xiong, HP., Chen, B. et al. Joining of SiO2f/SiO2 composite to Al2O3 ceramic using AgCu-Ti brazing filler metal. Weld World 61, 181–186 (2017). https://doi.org/10.1007/s40194-016-0389-6

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  • DOI: https://doi.org/10.1007/s40194-016-0389-6

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