Skip to main content
SpringerLink
Log in

The use of radiation-cured adhesives on adhesive stud assembly process

  • Research Paper
  • Published:
Welding in the World Aims and scope Submit manuscript

Abstract

The use of adhesive studs is gaining an importance as a method for assembly and mounting options as part of the trend towards multi-material design. For the efficient implementation of this technique, it is crucial that a reproducible and—above all—fast manufacturing process can be guaranteed. The use of radiation-cured adhesive provides a good solution. In context of a research project, which was performed at the Laboratory of Material and Joining Technology at the University of Paderborn, adhesives studs are characterized in terms of application-specific requirements, e.g., behavior under different loads or the combination with environmental influences or process time. The results that were achieved through the research show the potential of adhesive studs for assembly applications. The mechanical properties meet the requirements of a wide range of mounting options. Total cycle times under 10 seconds provide the basis for adhesive studs to be a real competitor to the established mechanical and thermal joining technologies.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. Meschut G, Süllentrop S (2012) Eigenschaftsprofil Klebbolzen, 12. Kolloquium Gemeinsame Forschung in der Klebtechnik, DECHEMA, Frankfurt, 29. Februar 2012

  2. Meschut G, Süllentrop S, Drüke F (2012) “Adhesive studs based on radiation-cured adhesives”, Joining in Car Body Engineering 2012—adhesive bonding and hybrid bonding, Automotive Circle International, Bad Nauheim, 17. April 2012

  3. Hose R, Scholl B, Tobisch-Haupt R, Werner W (2007) BOND it—reference book on bonding technology, 2nd, revised and extended English edition, Delo, Windach

  4. Wellmann S (2008) Superschnell und trotzdem zuverlässig, erschienen in: Adhäsion - Kleben & Dichten, 12/2008, S. 31–34

  5. Becker HG (1991) (Hrsg.): Einführung in die Photochemie, 3. bearb. Aufla-ge, Dt. Verlag der Wissenschaft, Berlin

  6. Crivello JV, Dietliker K (1998) Photoinitiators for Free Radical Cationic & Anionic Photopolymerisation, 2nd edn. Wiley, London

  7. Foussier JP, Allonas X, Burget D (2003) Photopolymerization reactions under visible lights—principle, mechanisms and examples of applications, erschienen in: Progress in organic coatings, 47/2003, S. 16–36

  8. (2010) N.N.: Bestimmung des Kohlenstoff-Doppelbindungsgehaltes von lichthärtenden Acrylat-Klebstoffen mittels IR-Spektroskopie, DELO Prüfnorm 43, DELO Industrieklebstoffe, Windach

Download references

Acknowledgments

The IGF project 16.778 N (DVS: 08.071) of the research association Schweißen und verwandte Verfahren e.V. of the DVS, Aachener Str. 172, 40223 Düsseldorf was funded by the AiF under the program for the promotion of joint industrial research and development (IGF) by the Federal Ministry of Economics and Technology based on a decision of the German Bundestag. We also thank the members of the project support committee for their organizational and financial support.

Author information

Authors and Affiliations

  1. Laboratory of Material and Joining Technology, University of Paderborn, Paderborn, Germany

    Gerson Meschut & Sebastian Süllentrop

Authors
  1. Gerson Meschut
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Sebastian Süllentrop
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Sebastian Süllentrop.

Additional information

Doc. IIW-2491, recommended for publication by Commission XVI “Polymer Joining and Adhesive Technology.”

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Meschut, G., Süllentrop, S. The use of radiation-cured adhesives on adhesive stud assembly process. Weld World 58, 755–762 (2014). https://doi.org/10.1007/s40194-014-0176-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40194-014-0176-1

Keywords

Search

Navigation