Adhesive joining of PCD cutting segments onto a saw band for machining mineral material

Abstract

The innovative technology of cutting mineral materials with a geometrically defined cutting edge, using a band saw, needs further development and improvement as regards the joining method of the individual cutting elements. So far, the joining methods soldering and welding have caused significant problems for the cutting process. For this reason, the aim of the testing series is to prove that geometrically defined cutting elements can be joined to the saw bands through adhesive bonding. However, when using a geometrical defined cutting edge to cut mineral material, it is very important that the cutting element, which is coated with a polycrystalline diamond (PCD) layer, is positioned exactly, as readjustments are not possible later. When using soldering or welding methods, the cutting element cannot be positioned accurately at all, as the heat that evolves during these processes causes thermal deformations. Not needing high temperatures, adhesive bonding has the further advantage that the crystalline structure of the PCD element is not damaged either. Testing showed that these adhesively joined bonds hold well when cutting granite. Further research was concentrated on the temperature level during the cutting process, both with additional cooling and without. This article aims to show the potential of adhesive bonding and the resulting opportunities for the cutting process with geometrically defined cutting elements and finally concludes that further research is necessary.