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Monitoring and damage detection of adhesive bonds with micro-encapsulated markers

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Abstract

The quality and durability of adhesive bonds are affected by aging processes. Therefore, appropriate monitoring for early damage detection is essential for such bonds. For these reasons, we set out to develop an adhesive-based joining technology that makes early detection of potential defects in adhesive bonds possible. In this method, various dyes are added to the adhesive used, which indicate, if the specific load is exceeded. These dyes are micro-encapsulated through different methods, producing capsules of different sizes and wall thicknesses. When an adhesive bond is damaged or overloaded, the capsule would break and the dye would be released. The released colors can be detected optically or with suitable measurement systems. To demonstrate this technology, various experiments were carried out. Firstly, changes in adhesive properties were checked through thermal analysis and then pure substance specimens were produced and tested as means of comparison. Finally, the formulated adhesives were used to produce specimens for compressive shear tests, using glass and aluminium. The advantage of this technology by comparison to conventional nondestructive testing methods is the possibility to detect defects in adhesive bonds before the durability of the adhesive bond itself is affected.

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References

  1. Luhn R, Sändig S, Geiß P, Wagner A (2008) Verbesserung der Langzeitbeständigkeit von Glasklebungen durch prozessintegrierte Oberflächenvorbehandlungsverfahren, 8. Kolloquium Gemeinsame Forschung in der Klebtechnik, 1–10

  2. Hasenberg D, Dilger K, Böhm S (2005) Zerstörungsfreie Prüfung von Klebverbindungen mittels der ultraschallangeregten Thermografie, TU Braunschweig, 5. Kolloquiuum, Gemeinsame Forschung in der Klebtechnik, 1–30

  3. Zäh MF, Mosandl T, Schlickenrieder K (2004) Zerstörungsfreie Prüfverfahren in der Klebtechnik—Stark im Verbund. In: Qualität und Zuverlässigkeit; 29. Jahrgang 2004; S. 58–59

  4. Zäh MF, Kosteas D, Mosandl T, Michaloudaki M et al (2003) Zerstörungsfreie Prüfverfahren—Erzielbare Resultate und industrielle Umsetzbarkeit. In: Adhäsion; 2003; S. 18–23

  5. Sliwka W (1975) Mikroverkapselung. In: Angewandte Chemie. S. 556–566; 87. Jahrgang 1975

  6. Bauer H (1985) Einsatz von mikroverkapseltem Klebstoff in der Schraubenindustrie. In: Aktuelle und zukünftige Aufgaben beim Kleben und Dichten in der Praxis des Fahrzeugbaus; 1985; S. 163–178

  7. Green BK (1957) Oil-containing microscopic capsules and method of making them. US-Patent 28 00 458 1953; 1957

  8. White SR, Sottos NR, Geubelle PH, Moore JS et al (2001) Autonomic healing of polymer composites. Nature 409:794–797

    Article  Google Scholar 

  9. Keller MW, Sottos NR (2005) Mechanical properties of microcapsules used in a self-healing polymer. Department of Theoretical and Applied Mechanics and Beckman Institute for Advanced Science and Technology, University of Illonois at Urbana-Champaign; S. 1–15

  10. Yang J, Keller MW, Moore JS, White SR, Scottos NR (2008) Microencapsulation of isocyanates for self-healing poylmers. In: Macromolecules; American Chemical Society; S. 9650–9655

  11. Shansky E (2006) Syntehsis and characterization of microcapsules for self-healing materials. Department of Chemistry, Indiana Univerisity; S. 514–546

  12. Fraunhofer Mediendienst (2010) Kopfschutz mit Duftnote. Fraunhofer-Presse. Thema 2

  13. Ghosh SK (2006) Functional coatings by polymer microencapsulation. WILEY-VCH Verlag, Weinheim

    Book  Google Scholar 

  14. Hobein B, Lutz B (1989) Mikroverkapselung. Aulis Verlag Deubner, Köln

    Google Scholar 

  15. Marx T (1999) Thermo- bzw. photosensitive Mikrokapseln für den Einsatz in Tonern und Laserdruckern. Herbert Utz Verlag, München

    Google Scholar 

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Correspondence to H. Thiede.

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Doc. IIW-2415, recommended for publication by Commission XVI “Polymer Joining and Adhesive Technology”

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Thiede, H., Koerte, F., Kahlmeyer, M. et al. Monitoring and damage detection of adhesive bonds with micro-encapsulated markers. Weld World 58, 253–259 (2014). https://doi.org/10.1007/s40194-013-0099-2

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  • DOI: https://doi.org/10.1007/s40194-013-0099-2

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