Design of energy-aware interconnects for next generation micro systems

  • Rohit SharmaEmail author
  • Somesh Kumar
S.I. : Visvesvaraya


This paper presents an overview of the problem of surface roughness in ultra-scaled Copper (Cu) interconnects. It is seen that surface roughness can severely degrade the electrical and thermal performance of Cu interconnects. This penalty has largely been ignored that has resulted in fairly optimistic models and estimates. It is in this context that this paper and our ongoing work gains significance. The authors make an attempt to present the big picture with reference to interconnect surface roughness and its implications on various design metrics.


High-speed interconnects Surface roughness 3D ICs Electrical performance 



The authors gratefully acknowledge the help and support received from the Visvesvaraya PhD Scheme, Ministry of Electronics and IT and members of the Nanoelectronics Research Lab, IIT Ropar.


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Copyright information

© CSI Publications 2019

Authors and Affiliations

  1. 1.Department of Electrical EngineeringIndian Institute of Technology RoparRupnagarIndia
  2. 2.ABV - Indian Institute of Information Technology and Management GwaliorGwaliorIndia

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