Skip to main content
Log in

The Crux of the Matter is the Connection

  • Cover Story
  • Electrical Powertrain
  • Published:
ATZelektronik worldwide Aims and scope

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

FIGURE 1
FIGURE 2
FIGURE 3
FIGURE 4
FIGURE 5
FIGURE 6
FIGURE 7

References

  1. Sattler, M.: Materials Solutions for Power Electronics — Packaging Technology and its True Significance. In: ATZelektronik worldwide 11 (2016), No. 4, pp. 38–45

    Google Scholar 

  2. Krebs, T.; Duch, S.; Schmitt, W.; Kötter, S.; Prenosil, P.; Thomas, S.: A Breakthrough in Power Electronics Reliability. Electronic Components & Technology Conference, 2013

    Google Scholar 

  3. Rudzki, J.; Osterwald, F.; Becker, M; Eisele, R.: Power Modul with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers. 8th International Conference on Integrated Power Electronics Systems, CIPS, Nuermberg 2014

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Sattler, M., Hinrich, A. & Klein, A. The Crux of the Matter is the Connection. ATZ Elektron Worldw 11, 16–21 (2016). https://doi.org/10.1007/s38314-016-0062-2

Download citation

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s38314-016-0062-2

Navigation