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Electronic Materials Letters

, Volume 15, Issue 3, pp 287–296 | Cite as

Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package

  • Seunghyun ChoEmail author
  • Youngbae Ko
Original Article - Electronics, Magnetics and Photonics
  • 57 Downloads

Abstract

This paper is about study on warpage, creep strain and the total strain energy density (TSED) effect on fatigue life of the solder joints in the embedded package under thermal cycling conditions by finite element method. In order to investigate the influence of material of solder joints in embedded package, four materials (SAC305, SnAgCu, Sn96.5Ag3.5, Pb97.5Sn2.5) of solder joints were used. Calculated results show that warpage of package was low, creep strain and TSED of solder joints were low in embedded package. Therefore the fatigue life of the solder joint in embedded package increases. Also, the fatigue life of solder joints of Sn96.5Ag3.5 would be highest among solder materials because of the lowest of TSED.

Graphical Abstract

Keywords

Embedded package Solder joints Warpage Creep strain PSED FEM 

Notes

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Copyright information

© The Korean Institute of Metals and Materials 2019

Authors and Affiliations

  1. 1.Mechanical Engineering DepartmentDongyang Mirae UniversityGuro-GuRepublic of Korea
  2. 2.Molds and Dies Technology R&BD GroupKITECHYeonsu-Gu, IncheonRepublic of Korea

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