Abstract
Thin film of copper oxide was deposited onto a silicon substrate through DC magnetron sputtering system. Nitrogen ions (N+) were implanted into the film using Pelletron Accelerator at different doses (5 × 1012, 5 × 1013 and 5 × 1014 ions/cm2) while maintaining a constant ion energy of 300 keV. The X-ray diffraction study revealed a diffraction peak of CuO (− 111) in all the samples. The crystallite size of CuO decreased at 5 × 1012 ions/cm2 and then increased with the dose up to 5 × 1014 ions/cm2. The decrease in crystallite size was attributed to structural disorder in the film caused by ions irradiation, while at relatively higher doses (> 5 × 1012 ions/cm2), localized thermal effects improved the structural ordering of the material through the annihilation of defects. The surface morphology of the film showed a decrease in its grain size at 5 × 1012 ions/cm2, followed by an increase with a further increase in the ion dose. N+ implantation at 5 × 1012 ions/cm2 decreased the surface roughness of CuO, while the roughness remained constant at the higher doses. The electrical resistivity of CuO decreased upon N+ implantation at 5 × 1012 ions/cm2 and then increased with a further increase in the ion dose. The band gap of the CuO exhibited a similar trend to that of its resistivity and crystallite size. These findings show that the N+ implantation serves as an effective method for tuning the physical properties of the copper oxide film, for its superior performance in the electronic and optoelectronic devices.
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Ayub, M.A., Afzal, N., Rafique, M. et al. Physical Characteristics of Low-Dose Nitrogen Ions-Implanted Copper Oxide Thin Film on n-Si (100) Substrate. Arab J Sci Eng (2024). https://doi.org/10.1007/s13369-024-09107-1
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DOI: https://doi.org/10.1007/s13369-024-09107-1