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Toward residual-layer-free nanoimprint lithography in large-area fabrication

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Abstract

In the paper, residual-layer-free nanoimprint lithography for large-area fabrication is reviewed. In order to remove the residual layer during the imprint process, polymer resists and mold materials should be designed with the aspects of surface chemistry and mold geometries in mind. Various approaches for residual-layerfree nanoimprint lithography are discussed including incomplete filling by polymer mass, reverse imprint methods, self-removal techniques, and the employment of elastomeric mold deformation. In addition, issues that must be overcome to enable large-area roll-to-roll nanoimprinting without a residual layer are presented.

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Authors and Affiliations

  1. Department of Chemical & Biomolecular Engineering, Seoul National University of Science & Technology, Seoul, 139-743, Republic of Korea

    Hyunsik Yoon & Hyemin Lee

  2. Department of Chemical and Biomolecular Engineering, Sogang University, 1 Sinsu-dong, Mapo-gu, Seoul, 121-732, Republic of Korea

    Won Bo Lee

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  1. Hyunsik Yoon
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Yoon, H., Lee, H. & Lee, W.B. Toward residual-layer-free nanoimprint lithography in large-area fabrication. Korea-Aust. Rheol. J. 26, 39–48 (2014). https://doi.org/10.1007/s13367-014-0005-5

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