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Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles

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Abstract

The evolution of interfacial microstructure and its effect on shear strength under multiple reflow cycles for multi-walled carbon nanotubes (MWCNT)-reinforced Sn0.3Ag0.7Cu solder/copper joint was investigated. The melting characteristics, wettability and mechanical properties of the solder alloy were assessed. The addition of MWCNT in the range of 0.01–0.05 wt% improved the wettability, melting behaviour and mechanical strength of the SAC0307 solder alloy. The nanoparticles in small weight fraction (0.01–0.05 wt%) addition were more effective in retarding intermetallic compounds growth at the interface. Amongst all compositions studied, the SAC0307–0.05MWCNT nanocomposite showed significant improvement in the performance of SAC0307/Cu solder joint under multiple reflow condition. The nanoparticles’ reinforcement above 0.1 wt% of the solder alloy was ineffective in improving the solder performance due to increased clustering in the matrix.

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Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, National Institute of Technology Karnataka, Surathkal, 575 025, India

    Sanjay Tikale & K. Narayan Prabhu

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  1. Sanjay Tikale
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  2. K. Narayan Prabhu
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Correspondence to K. Narayan Prabhu.

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Tikale, S., Prabhu, K.N. Performance of MWCNT-Reinforced SAC0307/Cu Solder Joint Under Multiple Reflow Cycles. Trans Indian Inst Met 71, 2693–2698 (2018). https://doi.org/10.1007/s12666-018-1431-8

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  • DOI: https://doi.org/10.1007/s12666-018-1431-8

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