Transactions of the Indian Institute of Metals

, Volume 67, Issue 1, pp 115–121 | Cite as

Corrosion Behavior of Ultra Fine Grain Copper Produced by Accumulative Roll Bonding Process

  • A. Nikfahm
  • I. Danaee
  • A. Ashrafi
  • M. R. Toroghinejad
Technical Paper


In this study the effect of microstructure changes on the corrosion behavior of pure tough pitch copper in 3.5 % NaCl solution with pH = 5.5 at ambient temperature was studied. Accumulative roll bonding process as severe plastic deformation was applied up to 8 cycles to produce the ultrafine grain copper. For corrosion resistance investigations, the polarization and electrochemical impedance spectroscopy was used. Corrosion morphologies analyzed by FE-SEM microscopy after polarization and immersion tests. Results show the minimum corrosion resistance for cycle 2 and maximum corrosion resistance for cycle 8. Corrosion rate of copper decreased after it was rolled for forth time. The corrosion degradation in cycle 8 was uniform and it was intergranular for sample of cycle 2 and unrolled counterpart. The higher corrosion rate in cycle 2 was attributed to unstable microstructure and the uniform corrosion of cycle 8 was due to ultra fine grain formation.


Corrosion Copper Ultrafine grain Accumulative roll bonding 



Appreciation is to Iranian nano technology initiative council and Tabriz Oil Refining Company for their financially supports of this work. Authors would also like to express their sincere gratitude to Eng. K. Irani for cooperation and coordination throughout this research.


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Copyright information

© Indian Institute of Metals 2013

Authors and Affiliations

  • A. Nikfahm
    • 1
  • I. Danaee
    • 1
  • A. Ashrafi
    • 2
  • M. R. Toroghinejad
    • 3
  1. 1.Abadan Faculty of Petroleum EngineeringPetroleum University of TechnologyAbadanIran
  2. 2.Department of Materials Engineering, Faculty of EngineeringShahid Chamran UniversityAhvazIran
  3. 3.Department of Materials EngineeringIsfahan University of TechnologyIsfahanIran

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