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An Analysis on the Effect of Temperature on Electrocrystallization Mechanism During Deposition of Cu Thin Films

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Abstract

The electrodeposition of copper on graphite was investigated at various bath temperatures of 25, 20, 15, 10 and 5 °C. Copper deposits were formed potentiostatically and characterized by electrochemical methods and scanning electron microscopy. It was found that the deposition of copper had mixed mass and charge transfer kinetics. Copper nucleated according to 3D instantaneous mechanisms for all temperature ranges. The extent of nucleation was found to be increased at low temperatures with a transition of dendritic type morphology to spherical copper deposition.

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Acknowledgments

The authors would like to thank the National Institute of Technology (NIT), Rourkela for providing the necessary financial and infrastructural supports.

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Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, National Institute of Technology, Rourkela, 769008, India

    Archana Mallik

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  1. Archana Mallik
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Correspondence to Archana Mallik.

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Mallik, A. An Analysis on the Effect of Temperature on Electrocrystallization Mechanism During Deposition of Cu Thin Films. Trans Indian Inst Met 66, 79–85 (2013). https://doi.org/10.1007/s12666-012-0229-3

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  • DOI: https://doi.org/10.1007/s12666-012-0229-3

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