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Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles

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Abstract

Boron carbide a hard refractory semiconductor ceramic material due to its unique structural properties and high neutron cross section finds application as structural materials and neutron shielding material. Its applicability is reduced due to low sinterbility and dispersiblity which can be overcome by copper coating. The effect of Electroless coating parameters on the surface deposits is characterised. The studies revealed that uniform and smooth coating was observed for pH11 at bath temperature of 348K. The prolonged suspension of B4C particles on the reaction bath has little effect on coating but it inturns reduces the adhesion of coating on activated particles.

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References

  1. Harris S J, Wear 252 (2002) 161

    Article  CAS  Google Scholar 

  2. Riedel R, Adv. Mater. 6 (1990) 549

    Article  Google Scholar 

  3. Toshie Harazono, Yukiyo Hiroyama, and Tokuko Watanabe, Bull. Chem. Soc. Jpn 69 (1996) 2419.

    Article  CAS  Google Scholar 

  4. Khanra A K, Bull. Mater. Sci, 30[2] (2007) 93.

    Article  CAS  Google Scholar 

  5. Suri A K, Subramanian C, Sonber J K and Ch. Murthy T S R, International Materials Reviews, 55[1] (2010) 4.

    Article  CAS  Google Scholar 

  6. Alizadeh A, Nassaj E T and Ehsani N, J. Eur. Ceram. Soc. 24 (2004) 3277.

    Google Scholar 

  7. Changxia Liu, Junlong Sun, Ceramics International 36 (2010) 1297.

    Article  CAS  Google Scholar 

  8. Suzuya Yamadaa, Kiyoshi Hiraob, Yukihiko Yamauchi, Shuzo Kanzaki, Journal of the European Ceramic Society 23 (2003) 561.

    Article  Google Scholar 

  9. Ozkan Sarikaya, Selahaddin Anik, Erdal Celik, S. Cem Okumus, Salim Aslanlar, Materials and Design 28 (2007) 2177.

    Article  CAS  Google Scholar 

  10. Thevenot F, J. Eur. Ceram. Soc, 6[4] (1990) 205.

    Article  CAS  Google Scholar 

  11. Abenojar J, Velasco F and Martinez M A (2007), J.Materials Processing Technology, 184: 441–446

    Article  CAS  Google Scholar 

  12. Roy T K, Subramanian C and Suri A K, Ceramics International 32 (2006) 227.

    Article  CAS  Google Scholar 

  13. Carusoa A N, Dowbena P A, Balkirb S, Nathan Schemmb, Kevin Osbergb, Fairchildf R W, Oscar Barrios Floresb, Snjezana Balazb, Harkenb A D, Robertson BW and Brand J I, Materials Science and Engineering: B 135[2] (2006) 129.

    Article  Google Scholar 

  14. Hongying Dong, Xiaojing Zhu and Kathy Lu, J Mater Sci, 43 (2008) 4247.

    Article  CAS  Google Scholar 

  15. Kathy Lu and Xiaojing Zhu, J. Am. Ceram. Soc, 92[7] (2009) 1500.

    Article  CAS  Google Scholar 

  16. Mark J. Pender, Kersten M. Forsthoefel, and Larry G. Sneddon, Pure Appl.Chem, 75(9) (2003) 1287.

    Article  CAS  Google Scholar 

  17. Skorokhod V, Vlajic M D and Krstic, V D, J. Mater. Sci. Lett, 15(8) (1996) 1337.

    CAS  Google Scholar 

  18. Levin L, Frage N and Dariel, M P, Metall. Mater. Trans A 30A(12) (1999) 3201.

    Article  CAS  Google Scholar 

  19. Ozkan Sarikaya, Selahaddin Anik, Erdal Celik, Cem Okumus S and Salim Aslanlar, Materials and Design 28 (2007) 2177.

    Article  CAS  Google Scholar 

  20. Suzuya Yamadaa, Kiyoshi Hiraob, Yukihiko Yamauchi and Shuzo Kanzaki, Ceramics International, 29 (2003) 299.

    Article  Google Scholar 

  21. Carden; Robin A, United States Patent 5700962, (1997)

  22. Onoro J, Salvador M D and Cambronero L E G, J. Materials Science and Engineering A, 499 (2009) 421.

    Article  Google Scholar 

  23. Thomas M. Lillo, J. Materials Science and Engineering A, 410–411 (2005) 443.

    Article  Google Scholar 

  24. Chih-Chung Wang, US Patent No: 4, 459, 327

  25. Tadashi Maruyama and Shoji Onose, Journal of Nuclear Science and technology, 36[4] 380.

  26. Natividad E, Lataste E, Lahaye M, Heintz J M and Silvain J F, Surface Science, 557 (2004) 129.

    Article  CAS  Google Scholar 

  27. Rahul Sharma, Agarwala R C and Agarwala V, Applied Surface Science, 252 (2006) 8487.

    Article  CAS  Google Scholar 

  28. Prasanta Sahoo, Materials and Design, 30 (2009) 1341.

    Article  CAS  Google Scholar 

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Correspondence to J. P. Deepa.

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Deepa, J.P., Resmi, V.G., Rajan, T.P.D. et al. Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles. Trans Indian Inst Met 64, 47 (2011). https://doi.org/10.1007/s12666-011-0009-5

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  • DOI: https://doi.org/10.1007/s12666-011-0009-5

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