Abstract
Drought stress limits the growth and yield of essential oils of valuable medicinal plants such as feverfew (Tanacetum parthenium). So, foliar application efficiency of nano-silicon complexes (glycine-nano-silicon, histidine-nano-silicon, glutamine-nano-silicon) was assessed on the growth and yield of feverfew, in a 120-day period of drought stress that was imposed by different irrigation gaps (4, 8 and 12 days). Nano-silicon compounds were sprayed on plants at three concentrations (zero-control, 1.5 and 3.0 mM) at 10-day intervals. The results showed that with increasing intensity of drought stress, leaf water saturation, accumulation of hydrogen peroxide and malondialdehyde increased and membrane damage in the leaf developed. With the loss of leaf water content and the development of oxidative damage, biomass accumulation, leaf area, the number of flowering branches in the plant decreased. Under severe drought stress, antioxidant capacity, phenol accumulation and essential oil yield decreased. The application of nano-silicon complexes limited tissue dehydration (35%) and the development of oxidative damage (30%) under drought stress conditions and restored the growth (25%) and yield of plant essential oils (30%). There was no significant difference between 1.5 and 3.0 mM nano-silicon compounds in most of the evaluated indices and glycine-nano-silicon combination was most effective in increasing plant drought tolerance.
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The datasets generated during and/or analysed during the current study are available from the corresponding author on reasonable request.
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All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by Shabnam Esmaili, and Bahram Amiri. The first draft of the manuscript was written by Vahid Tavallali and all authors commented on previous versions of the manuscript.
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Esmaili, S., Tavallali, V., Amiri, B. et al. Foliar Application of Nano-Silicon Complexes on Growth, Oxidative Damage and Bioactive Compounds of Feverfew Under Drought Stress. Silicon 14, 10245–10256 (2022). https://doi.org/10.1007/s12633-022-01754-z
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DOI: https://doi.org/10.1007/s12633-022-01754-z