Abstract
In this work, we propose a Germanium Fin Buried Oxide (FinBOX) Fin Electron-Hole Bilayer Tunnel FET (FBF-EHBTFET) structure. The proposed structure eliminates the gated underlaps and corner effect and also leads to an improved parasitic performance. This also reduces the device base area by ~ 25%. Further, the FinBOX provides an improved OFF state leakage suppression of more than three orders in comparison to the conventional FinEHBTFET. The proposed FinBOX EHBTFET with vertical non-gated underlaps also provides an excellent ION/IOFF ratio > 2 × 108 at VGS=VDS = 0.5 V. Furthermore, the leakage suppression and reduced miller capacitance effect provides an excellent transient response with a better voltage scalability window when scaled from VDD = 0.5 V to 0.4 V. A ~ 41% improved total propagation delay is achieved at VDD = 0.4 V with ~ 61% suppressed overshoot.
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Acknowledgments
This work was supported by the Council of Scientific and Industrial Research (CSIR), Government of India through Senior Research Fellowship scheme (File No. 09/466 (0213)/ 2 K19-EMR-II). The authors would also like to acknowledge the support from Taif University Researchers Supporting Project number (TURSP-2020/264), Taif University, Saudi Arabia.
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Ashita, Loan, S.A., Alkhammash, H.I. et al. A FinBOX Based Ge FinEHBTFET: Design and Investigation. Silicon 14, 2165–2174 (2022). https://doi.org/10.1007/s12633-021-01006-6
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DOI: https://doi.org/10.1007/s12633-021-01006-6