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Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications

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Abstract

The current investigation focuses on the slicing characteristics of silicon, a hard and brittle solid that is very difficult to cut, with abrasive water jet machining (AWJM) process by varying different operational parameters like abrasive flow rate (QA), traverse rate (TR), water pressure (P) and stand-off distance (SOD). The trials were carried out based on Taguchi L9 orthogonal array with multi-response characteristics optimization using the Technique of Order Preference Similarity to the Ideal Solution (TOPSIS) approach. The main effect plot is drawn for the relative closeness coefficient (Cn*) and TOPSIS. The most favorable combinations of the experiment are obtained from the response diagram, traverse rate at level 3, abrasive flow rate at level 3, water pressure at level 3 and standoff distance at level 1 for minimizing the surface roughness, and maximizing the Material Removal Rate (MRR) and flatness. A Field Emission Scanning Electron Microscope (FESEM) and Atomic force microscopy (AFM) study were carried out to observe the quality of the obtained sliced surfaces. The optical characteristics like reflectance and absorption of the laser textured and sliced surfaces are measured using a UV-VIS spectrophotometer, which reveals the significant enhancement in the optical properties, in the case of the laser textured surface.

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Authors and Affiliations

  1. Department of Mechanical Engineering, SRM Institute of Science and Technology, Chennai, 603203, India

    S. Oliver Nesa Raj & S. Prabhu

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  1. S. Oliver Nesa Raj
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  2. S. Prabhu
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Correspondence to S. Prabhu.

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Raj, S.O.N., Prabhu, S. Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications. Silicon 13, 4481–4499 (2021). https://doi.org/10.1007/s12633-020-00766-x

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  • DOI: https://doi.org/10.1007/s12633-020-00766-x

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