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Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces fabricated by double rolling

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Abstract

Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces were fabricated by double rolling. The two surface morphologies of double-rolled copper foils are quite different, and the surface roughness values are 61 and 1095 nm, respectively. The roughness value of matt surface can meet the requirement for bonding the resin matrix with copper foils used for flexible printed circuit boards, thus may omit traditional roughening treatment; the microstructure of double-rolled copper foils demonstrates an obviously asymmetric gradient feature. From bright surface to matt surface in thickness direction, the average grain size first increases from 2.3 to 7.4 μm and then decreases to 3.6 μm; compared with conventional rolled copper foils, the double-rolled copper foils exhibit a remarkably increased bending fatigue life, and the increased range is about 16.2%.

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Authors and Affiliations

  1. School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China

    Xi-yong Wang, Xue-feng Liu & Wen-jiang Zou

  2. Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing, 100083, China

    Xue-feng Liu & Jian-xin Xie

  3. Key Laboratory for Advanced Materials Processing (Ministry of Education), University of Science and Technology Beijing, Beijing, 100083, China

    Jian-xin Xie

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  1. Xi-yong Wang
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  2. Xue-feng Liu
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Correspondence to Xue-feng Liu.

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Wang, Xy., Liu, Xf., Zou, Wj. et al. Copper foils with gradient structure in thickness direction and different roughnesses on two surfaces fabricated by double rolling. Int J Miner Metall Mater 20, 1170–1175 (2013). https://doi.org/10.1007/s12613-013-0851-z

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  • DOI: https://doi.org/10.1007/s12613-013-0851-z

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