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Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges

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Abstract

As electronic waste poses environmental challenges, exploring eco-friendly alternatives becomes imperative. In this review, the introduction reveals the disposal problem of existing printed circuit boards (PCBs) and the potential impacts of implementing biodegradable PCBs towards the United Nations Sustainable Development Goals. Various biodegradable materials, including polylactic acid, cellulose/cellulose acetate, silk proteins, gelatin, polyvinyl alcohol, mycelium, and wood, were evaluated for their properties and suitability in PCB manufacturing. Each material is scrutinised for its suitability in creating environmentally friendly circuit boards. The study meticulously analyses these biodegradable PCBs' electrical, mechanical, thermal and decomposition properties, providing insights into their performance under various conditions. The article also explores different fabrication methods and their advantages and limitations for manufacturing biodegradable PCBs. Solvent and non-solvent based decomposition of the biodegradable PCBs were revealed. The research outcome on a balance between hygroscopic property and degradability of biodegradable PCBs is revealed. The narrative extends to encompass the challenges and issues associated with the Design-for-Manufacturing processes and life cycle assessment of biodegradable PCBs, shedding light on potential hurdles and areas for improvement. The article concludes with a forward-looking perspective on the future of biodegradable printed circuit boards, environmentally friendly fire-retardants, a proposal for alternative standards for biodegradable PCBs, and their increasing role in sustainable electronics.

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Acknowledgements

This research was supported by Universiti Tun Hussein Onn Malaysia Industry (UTHM) through Industry Matching Grant (Vot. No.: Q331).

Funding

The research was financially supported by the Industry Matching Grant (Vot. No. Q331) awarded by Universiti Tun Hussein Onn Malaysia (UTHM).

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Authors and Affiliations

  1. Microelectronics and Nanotechnology–Shamsuddin Research Centre, Institute for Integrated Engineering, Universiti Tun Hussein Onn Malaysia, 86400, Parit Raja, Batu Pahat, Johor, Malaysia

    Chin Fhong Soon

  2. Faculty of Electrical and Electronics Engineering, Universiti Tun Hussein Onn Malaysia, 86400, Parit Raja, Batu Pahat, Johor, Malaysia

    Chin Fhong Soon, See Khee Yee, Intan Sue Liana Abd Hamed & Kian Sek Tee

  3. Department of Electrical and Computer Engineering, Kulliyah of Engineering, International University of Islam Malaysia, 53100, Kuala Lumpur, Malaysia

    Anis Nurashikin Nordin, Rosminazuin Ab Rahim & Nur Hanisah Azmi

  4. BIOSES Research Interest Group, Faculty of Science and Marine Environment, Universiti Malaysia Terengganu, 21030, Kuala Nerus, Terengganu, Malaysia

    Nyuk Ling Ma

  5. Soft Soil Research Centre, Institute for Integrated Engineering, Universiti Tun Hussein Onn Malaysia, 86400, Parit Raja, Batu Pahat, Johor, Malaysia

    Norshuhaila Mohamed Sunar

  6. Green Innovation and Energy Sdn. Bhd, Taman Pelangi, 80400, Johor Bahru, Johor, Malaysia

    Chris Heng

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CFS designed the concept of the manuscript and written the first draft. NMS carried out the data curation. ISLAH and CH performed the data analysis. CFS, SKY, ANN, RAR, NLM, KST wrote the manuscript with input from all authors. CFS conceived the study and managed overall direction and planning.

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Soon, C.F., Yee, S.K., Nordin, A.N. et al. Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges. Int. J. Precis. Eng. Manuf. (2024). https://doi.org/10.1007/s12541-024-01027-2

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