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Analysis of the Dynamic Diameter of Superthin Diamond Blades in the High Speed and Precison Dicing Process

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International Journal of Precision Engineering and Manufacturing Aims and scope Submit manuscript


During the planar lightwave circuit (PLC) splitter manufacturing process, high precision is essential. Controlling machining precision is extremely difficult during the high-speed-and-precision dicing process, which is empirically related to the rotational speed, static diameter and elastic modulus of diamond dicing blades and other factors. However, the effect of changes in the outer diameter of blades on machining precision has been disregarded in the PLC manufacturing process. In this research, we proposed a dynamic diameter (Dd) for describing changes in a blade’s outer diameter during the high-speed machining process. Dd is positively correlated with machining precision. Here, we derived a formula for calculating Dd that is related to the rotational speed, static diameter, elastic modulus, Poisson’s ratio, density, cutting length and radial wear rate of diamond dicing blades. Furthermore, a series of experimental Dd values was obtained by changing the rotational speed, static diameter and elastic modulus of diamond dicing blades. These values are highly consistent with the calculated results. Our findings not only provide clues to compensate for diameter during high-speed-and-precision dicing process, but also offer guidelines for a new design route of diamond tools.

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Dynamic diameter of a diamond dicing blade


Planar lightwave circuit splitters


Non Contact Setup


Fiber Array




analogue to digital

f :

Centrifugal force

ρ c :

Density of a diamond dicing blade

ρ m :

Density of metal binder

ρ d :

Density of diamond

ρ a :

Density of air pore

ω :

Angular velocity

r :


V d :

volume fraction of a diamond in diamond dicing blade

V a :

Volume fraction of air pore in a diamond dicing blade

E c :

Young’s modulus of a diamond dicing blade

E m :

Young’s modulus of metal binder

E d :

Young’s modulus of diamond

u :

Radial displacement of a rotary super-thin diamond blade

h :

Thickness of a diamond dicing blade

a :

Inner radius

b :

Outer radius

c :

Boundary of plastic area for a rotary diamond blade

R d :

Dynamic radius of a high-speed rotary diamond blade

D d :

Dynamic diameter of a high-speed rotary diamond blade

D s :

Static diameter of a diamond blade

V c :

Poisson’s ratio of a diamond dicing blade

V m :

Poisson’s ratio of metal binder

V d :

Poisson’s ratio of a diamond

σ r :

Radial stress

σθ :

Circumferential stress

ε r :

Radial strain

ε θ :

circumferential strain

n :

Rotational speed

l :

Cutting length of a diamond dicing blade

k :

Radial wear rate of a diamond dicing blade


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This project was sponsored by the Natural Science Foundation of Hebei Province of China (E2016203425) and the Key Projects of Scientific and Technological Research in Hebei Province (ZD2017074). This work was also supported by Zhengzhou Research Institute for Abrasives and Grinding Co. Ltd. and Yanshan University.

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Correspondence to Mingzhi Wang.

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Li, K., Wang, M., Chen, F. et al. Analysis of the Dynamic Diameter of Superthin Diamond Blades in the High Speed and Precison Dicing Process. Int. J. Precis. Eng. Manuf. 20, 1071–1081 (2019).

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