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Selective Electrochemical Etching of Stainless Steel Using a Laser-Patterned Copper Layer

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Abstract

This paper proposes a novel electrochemical etching process without the need for a metal mask or photo-resist mask. The selective electrochemical etching using laser-patterned (SEEL) copper layer process consists of three steps: electrodeposition, laser patterning, and electrochemical etching. In the SEEL copper layer process, a deposited copper layer was formed on stainless steel by an electrodeposition process. A patterned copper layer on stainless steel was formed by laser beam irradiation. A patterned copper layer serves as both a sacrificial layer and a protective mask during the electrochemical etching process. The results were observed via scanning electron microscopy and surface profiler measurement. The appropriate conditions for stable SEEL copper layer process were determined. Finally, selective electrochemical etching with various micro patterns on stainless steel was been successfully performed.

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Acknowledgement

This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. 2017R1C1B1005444).

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  1. School of Mechanical, Automotive and Aeronautical Engineering, Korea National University of Transportation, Chungju, Chungbuk, 380-702, South Korea

    Hong-Shik Shin

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  1. Hong-Shik Shin
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Correspondence to Hong-Shik Shin.

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Shin, HS. Selective Electrochemical Etching of Stainless Steel Using a Laser-Patterned Copper Layer. Int. J. Precis. Eng. Manuf. 20, 711–716 (2019). https://doi.org/10.1007/s12541-019-00099-9

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  • DOI: https://doi.org/10.1007/s12541-019-00099-9

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