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Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure

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Abstract

In order to realize the replication of high-quality polymer microstructures with vertical and smooth sidewalls, a gas-assisted hot embossing process with low pressure supplied was optimized to eliminate the swallowtail phenomenon during pattern transfer and simplify workpiece process setting. With help of passive alignment clamp, the rate of replication greater than 95.5% for vertical sidewalls was successfully obtained under the optimum process condition. Accordingly, a root mean square sidewall roughness of 4.6 nm was measured for polymer trenches in comparison with that of 5.7 nm for the silicon mold using a bevel-cut preparation technique. Furthermore, the rate of bulging of less than 15% for polymer workpiece was also obtained. The experiment has demonstrated that high-precise polymer pattern replication is related to both process settings and mold morphology sizes.

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Abbreviations

Te :

embossing temperature

Tg :

glass transition temperature

Tr :

demolding temperature

To :

atmospheric temperature

Pe :

embossing pressure

Po :

atmospheric pressure

t:

embossing temperature holding time

Wt :

top width of trench

Wb :

bottom width of trench

D:

depth of trench

D:

height of vertical sidewall

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Authors and Affiliations

  1. Laboratory of Nanophotonic Functional Materials and Devices, Institute of Optoelectronic Material and Technology, South China Normal University, 55, Zhongshan Road West, Guangzhou, 510631, China

    Lei Wan, Ning Zhu & Xuan Li

  2. Key Labs of Nanodevices and Applications, Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Science, 398, Ruishui Road, Suzhou, 215123, China

    Rui-ying Zhang

  3. Key Laboratory of Space Applied Physics and Chemistry, Ministry of Education and Shanxi Key Laboratory of Optical Information Technology, School of Science, Northwestern Polytechnical University, 127, Youyi Road West, Xi’an, 710072, China

    Ting Mei

Authors
  1. Lei Wan
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  2. Ning Zhu
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Correspondence to Ting Mei.

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Wan, L., Zhu, N., Li, X. et al. Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure. Int. J. Precis. Eng. Manuf. 17, 1067–1072 (2016). https://doi.org/10.1007/s12541-016-0129-2

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  • DOI: https://doi.org/10.1007/s12541-016-0129-2

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