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A study on large-area laser processing analysis in consideration of the moving heat source

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Abstract

This study proposed a way of reducing the time and memory required for analysis by adjusting the heat input area, to overcome the difficulties in analyzing large-area laser processing. An analytical model was manufactured using existing research results, and based on these results and the volume of the analysis, the efficiency of the new analysis method was verified. The new analysis method proposed in this study can be used as a simple analysis method utilizing a commercial analysis program for diverse areas, including the effect of temperature distribution on the material, the effect of temperature transfer on the mechanical structure, and thermal displacement prediction, in the thermal treatment after processing.

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Abbreviations

K:

the heat conductivity of the solid [W/mmK]

T:

the temperature [K]

SE:

the energy source [W]

ρ:

the density [kg/m3]

Cp:

the specific heat [J/kgK]

T:

the time [sec]

h:

the convective heat transfer coefficient [W/mmK]

Ts:

the surface temperature [K]

T∞:

the air temperature [K]

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Authors and Affiliations

  1. Mechanical Design and Manufacturing Engineering Department, Changwon University, 9, Salim-dong, Changwon, South Korea, 641-773

    Sung-Hwan Ahn & Choon-Man Lee

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  1. Sung-Hwan Ahn
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  2. Choon-Man Lee
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Correspondence to Choon-Man Lee.

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Ahn, SH., Lee, CM. A study on large-area laser processing analysis in consideration of the moving heat source. Int. J. Precis. Eng. Manuf. 12, 285–292 (2011). https://doi.org/10.1007/s12541-011-0038-3

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  • DOI: https://doi.org/10.1007/s12541-011-0038-3

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