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Evaluation of mechanical characteristics of the plate-type polymer hyperfine pit pattern by the nanoindentation process

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Abstract

It’s important to measure quantitative properties about the thermal-nano behavior of polymers in order to produce high quality components using the nanoimprint lithography process. Nanoscale indentation can be used to make the cells for molecular electronics, drug delivery, slots for integration into nanodevices and defects for tailoring both the structure and properties. In this study, the formability of polymethylmetacrylate (PMMA) and polycarbonate (PC) were characterized. Thermo-mechanical properties during formation at a high temperature. Polymers become softer at elevated temperature due to heating. In this case it is particularly important to study the high temperature-induced mechanical properties of the polymer. Nanoindentation was used to measure the thermo-mechanical properties of both PMMA and PC. The polymer was heated with the heating stage on a NanoXP. For a CSM (Continuous Stiffness Method) mode test, the heating temperature was 110°C, 120°C, 130°C, 140°C and 150°C for the PMMA, and 140°C, 150°C, 160°C, 170°C and 180°C for the PC. The maximum indentation depth for this test was 2000 nm. For the basic mode test, the heating temperature was 90°C and 110°C for the PMMA, and 140°C and 160°C for the PC. The maximum loads for this test were 10 mN, 20 mN and 40 mN. An indented pattern was also observed by using AFM. The pile-up phenomenon was mitigated due to the indentation at elevated temperature but the sink-in phenomenon occurred in this instance. When patterning at a high temperature, one should consider the variation in the indentation profile and depth after unloading when designing a structure. It was thought that the mechanical properties decrease when the working temperature increases because PMMA and PC are thermoplastics which soften or melt by heating. Further research in this area is required about the molecular weight and molecular movement at elevated temperature when the free volume of molecules increases.

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References

  1. Hardt, D., Ganesan, B., Oi, W., Dirckx, M. and Rzepniewski, A., “Process Control in Micro-Embossing: A Review,” Singapore MIT Alliance Programme (SMA) in Innovation in Manufacturing Systems and Technology (IMST), 2004.

  2. Choi, C. G., “Fabrication of optical waveguides in thermosetting polymers using hot embossing,” J. Micromech. Microeng., Vol. 14, No. 7, pp. 945–949, 2004.

    Article  Google Scholar 

  3. Kim, W. S., Yoon, K. B. and Bae, B. S., “Nanopatterning of photonic crystals with a photocurable silica-titania organic-inorganic hybrid material by a UV-based nanoimprint technique,” J. Mater. Chem., Vol. 15, No. 42, pp. 4535–4539, 2005.

    Article  Google Scholar 

  4. Ishihara, K., Fujita, M., Matusubara, I., Asano, T. and Noda, S., “Direct Fabrication of Photonic Crystal on Glass Substrate by Nanoimprint Lithography,” Japanese Journal of Applied Physics Part 2, Vol. 45, No. 4–7, pp. L210–L212, 2006.

    Article  Google Scholar 

  5. Heidari, B., Maximov, I. and Montelius, L., “Nanoimprint lithography at the 6 in. wafer scale,” J. Vac. Sci. Technol. B, Vol. 18, No. 6, pp. 3557–3560, 2000.

    Article  Google Scholar 

  6. Cameron, N. S., Roberge, H., Veres, T., Jakeway, S. C. and Crabtree, H. J., “High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction,” Lab Chip, Vol. 6, No. 7, pp. 936–941, 2006.

    Article  Google Scholar 

  7. Li, X. and Bhushan, B., “Fatigue studies of nanoscale structures for MEMS/NEMS applications using nanoindentation techniques,” Surface and Coatings Technology, Vol. 163–164, pp. 521–526, 2003.

    Article  Google Scholar 

  8. O’Connell, B. S., Cross, G. L. W., Pethica, J. B. and Oliver, W., “Nanorheology of squeezed polymer films,” Proc. Third IEEE Conference on Nanotechnology, Vol. 2, pp. 793–796, 2003.

    Article  Google Scholar 

  9. Guo, L. J., “Recent progress in nanoimprint technology and its applications,” J. Phys. D: Appl. Phys., Vol. 37, No. 11, pp. 123–141, 2004.

    Article  Google Scholar 

  10. Scheer, H. C. and Schulz, H., “A contribution to the flow behaviour of thin polymer films during hot embossing lithography,” Microelectronic Eng., Vol. 56, No. 3–4, pp. 311–332, 2001.

    Article  Google Scholar 

  11. Yao, D. and Virupaksha, V. L., “Study on Squeezing Flow During Nonisothermal Embossing of Polymer Microstructures,” Polymer Eng. and Sci., Vol. 45, No. 5, pp. 652–660, 2005.

    Article  Google Scholar 

  12. Park, J. W., Lee, D. W., Kawasegi, N. and Morita, N., “Nanoscale Fabrication in Aqueous Solution using Tribo-Nanolithography,” Int. J. Precis. Eng. Manuf., Vol. 7, No. 4, pp. 8–13, 2006.

    Google Scholar 

  13. Kang, H. J., Ahn, S. H., Lee, J. S. and Lee, J. H., “Surface Modification of Aluminum by Nitrogen-Ion Implantation,” Int. J. Precis. Eng. Manuf., Vol. 7, No. 1, pp. 57–61, 2006.

    Google Scholar 

  14. Fischer-Cripps, A. C., “Nanoindentation,” Springer-Verlag New York, pp. 74–76, 2002.

    Google Scholar 

  15. Stevens, M. P., “Polymerchemistry: 3rd Edition,” Oxford University Press, pp. 100–106, 1999.

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Authors and Affiliations

  1. National Core Research Center for Hybrid Materials Solution, Pusan National University, Jangjeon 2-dong, Geumjeong-gu, Busan, South Korea, 609-735

    Eun-Kyung Lee

  2. School of Mechanical Engineering, Pusan National University, Jangjeon 2-dong, Geumjeong-gu, Busan, South Korea, 609-735

    Chung-Gil Kang

  3. Engineering Research Center for Net Shape & Die Manufacturing, Pusan National University, Jangjeon 2-dong, Geumjeong-gu, Busan, South Korea, 609-735

    Sang-Mae Lee

Authors
  1. Eun-Kyung Lee
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  2. Chung-Gil Kang
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  3. Sang-Mae Lee
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Correspondence to Chung-Gil Kang.

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Lee, EK., Kang, CG. & Lee, SM. Evaluation of mechanical characteristics of the plate-type polymer hyperfine pit pattern by the nanoindentation process. Int. J. Precis. Eng. Manuf. 11, 461–468 (2010). https://doi.org/10.1007/s12541-010-0053-9

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  • DOI: https://doi.org/10.1007/s12541-010-0053-9

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