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Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles

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Abstract

A novel complex ink was fabricated by mixing Sn–58Bi nanoparticles with a commercial conductive ink containing Ag nanoparticles and then sintered rapidly for 110 s at 140 °C in air using a conveyor-type reflow furnace. Sn–58Bi nanoparticles smaller than 15 nm wetted on the neighboring Ag nanoparticles immediately after melting at temperatures lower than their melting point, and hence, acted as transient liquid-phase binders. The composite film sintered with 4 wt% Sn–58Bi exhibited stability and a low electrical resistivity of 4.46 μΩ cm, and hence, was found to be compatible with low-cost flexible films.

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References

  1. A. Kosmala, R. Wright, Q. Zhang, P. Kirby, Mater. Chem. Phys. 129, 1075 (2011)

    Article  Google Scholar 

  2. T.H.J. van Osch, J. Perelaer, A.W.M. de Laat, U.S. Schubert, Adv. Mater. 20, 343 (2008)

    Article  Google Scholar 

  3. M. Singh, H.M. Haverinen, P. Dhagat, G.E. Jabbour, Adv. Mater. 22, 673 (2010)

    Article  Google Scholar 

  4. S. Gamerith, A. Klug, H. Scheiber, U. Scherf, E. Moderegger, E.J.W. List, Adv. Funct. Mater. 17, 3111 (2007)

    Article  Google Scholar 

  5. K. Murata, J. Matsumoto, A. Tezuka, Y. Matsuba, H. Yokoyama, Microsyst. Technol. 12, 2 (2005)

    Article  Google Scholar 

  6. K. Cheng, M.H. Yang, W.W.W. Chiu, C.Y. Huang, J. Chang, T.F. Ying, Y. Yang, Macromol. Rapid Commun. 26, 247 (2005)

    Article  Google Scholar 

  7. D. Kang, E. Lee, H. Kim, Y.M. Choi, S. Lee, I. Kim, D. Yoon, J. Jo, B. Kim, T.M. Lee, J. Appl. Phys. 115, 234908 (2014)

    Article  Google Scholar 

  8. S. Merilampi, T. LaineMa, P. Ruuskanen, Microelectron. Reliab. 49, 782 (2009)

    Article  Google Scholar 

  9. S.B. Walker, J.A. Lewis, J. Am. Chem. Soc. 134, 1419 (2012)

    Article  Google Scholar 

  10. J. Perelaer, M. Klokkenburg, C.E. Hendriks, U.S. Schubert, Adv. Mater. 21, 4830 (2009)

    Article  Google Scholar 

  11. J. Perelaer, A.W.M. de Laat, C.E. Hendriks, U.S. Schubert, J. Mater. Chem. 18, 3209 (2008)

    Article  Google Scholar 

  12. S. Magdassi, M. Grouchko, O. Berezin, A. Kamyshny, ACS Nano 4, 1943 (2010)

    Article  Google Scholar 

  13. C.I. Yeo, J.H. Kwon, S.J. Jang, Y.T. Lee, Opt. Express 20, 19554 (2012)

    Article  Google Scholar 

  14. S. Lehtimaki, M. Li, J. Salomaa, J. Porhonen, A. Kalanti, S. Tuukkanen, P. Heljo, K. Halonen, D. Lupo, Int. J. Electr. Power Energy Syst. 58, 42 (2014)

    Article  Google Scholar 

  15. T.G. Lei, J.N. Calata, G.-Q. Lu, X. Chen, S. Luo, I.E.E.E. Trans, Compon. Packag. Technol. 33, 98 (2010)

    Article  Google Scholar 

  16. K.S. Siow, J. Alloys Compd. 154, 6 (2012)

    Article  Google Scholar 

  17. Y.M. Shin, H.J. Kim, S.P. Jang, J.H. Lee, J. Electron. Mater. 43, 3372 (2014)

    Article  Google Scholar 

  18. W.D. Kingery, J. Appl. Phys. 30, 301 (1959)

    Article  Google Scholar 

  19. F. Frongia, M. Pilloni, A. Scano, A. Ardu, C. Cannas, A. Musinu, G. Borzone, S. Delsante, R. Novakovic, G. Ennas, J. Alloys Compd. 623, 7 (2015)

    Article  Google Scholar 

  20. Y. Gao, C. Zou, B. Yang, Q. Zhal, J. Liu, E. Zhuravlev, C. Schick, J Alloys Compd. 484, 777 (2009)

    Article  Google Scholar 

  21. J. Zhao, Y. Gao, W. Zhang, T. Song, Q. Zhai, J. Mater. Sci.: Mater. Electron. 23, 2221 (2012)

    Google Scholar 

  22. A.G. Tefera, M.D. Mochena, E. Johnson, J. Dickerson, J. Appl. Phys. 116, 104301 (2014)

    Article  Google Scholar 

Download references

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Correspondence to Jong-Hyun Lee.

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Choi, W.L., Lee, JH. Low-Temperature Sintering Characteristics of Ag-Based Complex Inks Using Transient Melting and Joining of Sn–58Bi Nanoparticles. Met. Mater. Int. 25, 1388–1393 (2019). https://doi.org/10.1007/s12540-019-00293-4

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  • DOI: https://doi.org/10.1007/s12540-019-00293-4

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