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Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates

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Abstract

The effect of high-temperature pre-bake treatment on whisker formation was studied under various thermal and/or humidity and plating conditions for thin tin films on thick copper substrates. The pre-bake treatment was performed at 180 °C for 1 h. In tests conducted at 85 °C/85% relative humidity and ambient atmosphere, whisker formation was suppressed considerably when a pre-bake treatment was applied. After the pre-bake treatment, Cu3Sn intermetallic compounds were formed at the tin-copper interface. Cu3Sn IMCs play an important role in the formation of regular-shaped Cu6Sn5. Cu3Sn IMCs were also formed after temperature cycling and under conditions of 85 °C/85% RH. Irregular-shaped Cu6Sn5 IMCs were formed under all test conditions except for pre-baked samples in ambient atmosphere. A pre-bake treatment at 180 °C is advantageous for the inhibition of whisker formation and allows for planar and regular-shaped Cu3Sn to be produced.

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Authors and Affiliations

  1. School of Advanced Materials Science & Engineering, Sungkyunkwan University, Suwon-si, 440-746, Korea

    Seong-Hun Na, Mi-Ri Lee & Su-Jeong Suh

  2. Advanced Materials and Process Research for IT, Sungkyunkwan University, Suwon-si, 440-746, Korea

    Hwa-Sun Park & Su-Jeong Suh

  3. Smart e-Plating Regional Innovation System, Sungkyunkwan University, Suwon-si, 440-746, Korea

    Su-Jeong Suh

  4. ACI Division, Samsung Electro-Mechanics Co., LTD, Sejong-si, 339-702, Korea

    Heung-Kyu Kim

Authors
  1. Seong-Hun Na
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  2. Mi-Ri Lee
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  3. Hwa-Sun Park
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  4. Heung-Kyu Kim
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  5. Su-Jeong Suh
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Correspondence to Su-Jeong Suh.

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Na, SH., Lee, MR., Park, HS. et al. Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates. Met. Mater. Int. 20, 367–373 (2014). https://doi.org/10.1007/s12540-014-2016-7

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  • DOI: https://doi.org/10.1007/s12540-014-2016-7

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