Abstract
In this paper, we briefly report on a detailed investigation of the morphology of voids in the Fe-40 wt.%Ni alloy using the electron holography technique. By analyzing the phase shift across the voids, we could obtain visual information on their morphology. Moreover, the obtained thickness profiles of the voids allowed us to measure quantitatively their depth and width. The obtained results are very important for further investigations of the 3-dimensional (3D) morphology of void-type defects in the material.
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References
A. Tonomura, Electron Holography, 2nd ed., p. 2–8, Springer, Berlin, Heidelberg, New York, Tokyo (1999).
E. Völkl, L. F. Allard, and D. C. Joy, Introduction to Electron Holography, p. 17–43, Kluwer Academic, New York (1999).
D. Shindo and T. Oikawa, Analytical Electron Microscopy for Materials Science, p. 116–125, Springer, Tokyo (2002).
M. R. McCartney and D. J. Smith, Ultramicrosc. 94, 149 (2003).
W. D. Rau, P. Schwander, F. H. Baumann, W. Höppner, and A. Ourmazd, Phys. Rev. Lett. 82, 2614 (1999).
T. Kasahara, D. Shindo, H. Yoshikawa, T. Sato, and K. Kondo, J. Electron Microsc. 56, 7 (2007).
H. S. Park, Y. Murakami, D. Shindo, V. A. Chernenko, and T. Kanomata, App. Phys. Lett. 83, 3752 (2003).
J. Chengge and C. David, J. Electron. Microsc. 51, 105 (2002).
E. Müller, D. Gerthsen, P. Brückner, F. Scholz, Th. Gruber, A. Waag, Pys. Rev. B 73, 245316-1–9 (2006).
B.-J. Lee, J.-H. Shim, and J. H. Kwon, Met. Mater. Int. 14, 283 (2008).
A. Tonomura, Electron Holography, 2nd ed., p. 78–82, Springer, Berlin, Heidelberg, New York, Tokyo (1999).
E. Völkl, L. F. Allard, and D. C. Joy, Introduction to Electron Holography, p. 267–293, Kluwer Academic, New York (1999).
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Shaislamov, U., Yang, JM., Yoo, J.H. et al. Quantitative analysis of void morphology in Fe-40 wt.%Ni alloy by electron holography. Met. Mater. Int. 15, 887–890 (2009). https://doi.org/10.1007/s12540-009-0887-9
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DOI: https://doi.org/10.1007/s12540-009-0887-9