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Effects of various metal seed layers on the surface morphology and structural composition of the electroplated copper layer

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Abstract

This study examined the effects of depositing a seed layer on the surface morphology and the electric characteristics of an electrodeposited copper foil. Pt, Pd, a Pt-17Pd alloy and gold were used as the seed metals. The morphology, crystal structure, and electric characteristics of the electrodeposited copper foil were examined by scanning electron microscopy, X-ray diffraction, atomic force microscopy, and a four-point probe, respectively. The surface roughness, crystal growth orientation, and resistivity were controlled using various seed layers. Large particles were observed on the surface of the copper layer electroplated onto the Pd seed layer. However, a uniform surface was obtained when a Pt seed layer was used.

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Authors and Affiliations

  1. Division of Advanced Materials Engineering, Chonbuk National University, Jeonju-si, Jeonbuk, 561-756, Korea

    Tae-Gyu Woo, Il-Song Park & Kyeong-Won Seol

  2. Research Center of Industrial Technology, Chonbuk National University, Jeonbuk, 561-756, Korea

    Kyeong-Won Seol

Authors
  1. Tae-Gyu Woo
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  2. Il-Song Park
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  3. Kyeong-Won Seol
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Correspondence to Kyeong-Won Seol.

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Woo, TG., Park, IS. & Seol, KW. Effects of various metal seed layers on the surface morphology and structural composition of the electroplated copper layer. Met. Mater. Int. 15, 293–297 (2009). https://doi.org/10.1007/s12540-009-0293-3

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  • DOI: https://doi.org/10.1007/s12540-009-0293-3

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