Nano Research

, Volume 9, Issue 8, pp 2364–2371 | Cite as

Bestow metal foams with nanostructured surfaces via a convenient electrochemical method for improved device performance

  • Yawen Zhan
  • Shanshan Zeng
  • Haidong Bian
  • Zhe Li
  • Zhengtao Xu
  • Jian LuEmail author
  • Yang Yang LiEmail author
Research Article


Metal foams have been intensively studied as three-dimensional (3-D) bulk mass-support for various applications because of their high conductivities and attractive mechanical properties. However, the relatively low surface area of conventional metal foams largely limits their performance in applications such as charge storage. Here, we present a convenient electrochemical method for addressing this problem using Cu foams as an example. High surface area Cu foams are fabricated in a one-pot one-step manner by repetitive electrodeposition and dealloying treatments. The obtained Cu foams exhibit greatly improved performance for different applications like surface enhanced Raman spectroscopy (SERS) substrates and 3-D bulk supercapacitor electrodes.


electrodeposition dealloying metal foams surface enhanced Raman spectroscopy substrates supercapacitors 


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Supplementary material

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Copyright information

© Tsinghua University Press and Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  1. 1.Center of Super-Diamond and Advanced Films (COSDAF)City University of Hong KongKowloon, Hong KongChina
  2. 2.Department of Physics and Materials ScienceCity University of Hong KongKowloon, Hong KongChina
  3. 3.Department of Chemistry and BiologyCity University of Hong KongKowloon, Hong KongChina
  4. 4.Department of Mechanical and Biomedical EngineeringCity University of Hong KongKowloon, Hong KongChina
  5. 5.Centre for Advanced Structural MaterialsCity University of Hong Kong Shenzhen Research InstituteShenzhenChina
  6. 6.City University of Hong Kong Shenzhen Research InstituteShenzhenChina

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