Abstract
The uniformly distributed mini-pin-fins on the copper surface were designed and processed, and the enhanced boiling heat transfer performance on mini-pin-finned copper surfaces in FC-72 was investigated. The smooth copper surface was used as the experimental comparison group. The effect of the copper fin height, spacing, and width on the pool boiling heat transfer performance and the fin efficiency were investigated. At the same liquid subcooling, the critical heat flux and heat transfer coefficient of the uniformly distributed mini-pin-finned copper surface increased with the copper fin height, decreased with the rise of the copper fin spacing and fin width. The fin efficiency increases with the rise of the fin height, spacing, and width. The critical heat flux of the mini-pin-finned copper surface (PF0.3–0.2–2) reached 115.4 W·cm−2 at liquid subcooling of 25 K and increased by about 3.62 times compared with the smooth copper surface, and the heat transfer efficiency of mini-pin-finned copper surface (PF0.5–0.2–2) exceeded 95%.
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Abbreviations
- A :
-
Surface area of a silicon wafer(cm2)
- A PF :
-
Surface area of the uniform mini-pin-finned copper surfaces(cm2)
- A SS :
-
Surface area of smooth copper surface(cm2)
- A:
-
Length of silicon wafer (mm)
- h p :
-
Height of copper mini-pin-fins(mm)
- l :
-
Length of copper mini-pin-fins (mm)
- p :
-
Spacing of copper mini-pin-fins (mm)
- w :
-
Width of copper mini-pin-fins (mm)
- P :
-
Power(W)
- h(HTC):
-
Boiling heat transfer coefficient(W·m−2·K−1)
- CHF:
-
Critical heat flux (W·m−2)
- U :
-
Heating voltage(V)
- I :
-
Heating current(A)
- q :
-
Heat flux (W·m−2)
- T :
-
Temperature(K)
- ΔT :
-
Temperature difference(K)
- η f :
-
Mini-pin–fin Efficiency
- T f :
-
Liquid temperature(K)
- Max:
-
Maximum
- T sat :
-
Saturated temperature(K)
- T sub :
-
Subcooling temperature(K).
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Funding
This work is supported by the National Natural Science Foundation of China (No. 51976163), Key research and development program in Shaanxi Province of China (No.2021GXLH-Z-076), Joint Funds of the National Natural Science Foundation of China (No.U2141218, U1738119), Second batch of scientific experiment proposals aboard China Space Station (No.TGMTYY00-JY-53–1.00), and ESA-CMSA Joint Boiling Project (No.TGMTYY00-RW-05–1.00).
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Chen, H., Xu, P., Du, W. et al. Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72. Microgravity Sci. Technol. 34, 47 (2022). https://doi.org/10.1007/s12217-022-09968-x
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DOI: https://doi.org/10.1007/s12217-022-09968-x