Abstract
The conventional approach to temperature evolution in cyclic loading is explained by a hysteresis curve with three phases. However, it has not been matched with experimental data except in the beginning of the cyclic loading. Thus, this study suggests a new approach to temperature evolution with three phases in cyclic loading by plastic deformation using the thermoelastic effect. The sample was fabricated following ASTM D638 standard for cyclic loading, and the temperature was measured during the cyclic loading by an infrared camera. Thermography was used to observe partial heating caused by cracks. The results were evaluated with the correlation (R2) coefficient between temperature and the derived equation as 0.96 in phases 1 and 2. Also, the partial heating was observed showing the effect of cracks for the temperature evolution in phases 2 and 3. Based on these results, a new approach to temperature evolution in cyclic loading is suggested.
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Abbreviations
- V 0 :
-
Original volume
- Δ V :
-
Volume change
- x 0 :
-
Initial length in x - direction
- y 0 :
-
Initial length in y - direction
- z 0 :
-
Initial length in z - direction
- ε x :
-
Strain in x - direction
- ε y :
-
Strain in y - direction
- ε z :
-
Strain in z - direction
- v :
-
Poisson’s ratio
- Δ T :
-
Temperature change
- T 0 :
-
Initial temperature
- α :
-
Coefficient of thermal expansion
- ρ :
-
Density
- c p :
-
Heat capacity
- K :
-
Thermoelastic parameter
- A 0 :
-
Initial cross-sectional area
- ε plastic :
-
Plastic strain caused by viscoelasticity
- σ :
-
Stress
- dT f :
-
Temperature change due to heat conduction
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Acknowledgments
This work was supported by the Korea Institute for Advancement of Technology (KIAT) grant funded by the Korean government (MOTIE) (P0008458, HRD Program for Industrial Innovation), and also supported by Korea Institute of Energy Technology Evaluation and Planning (KETEP) grant funded by the Korea government (MOTIE) (20222020800130, Development and demonstration of hybrid power system using ORC(Organic Rankine Cycle) and TEG(Thermoelectric Generator) for low and medium temperature industrial waste heat recovery).
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Sanglok Park is a failure analysis R&D Engineer at Intel, Chandler, Arizona, United States. He received his M.E. and M.S. in Mechanical Engineering and Electronics Engineering from Inha University and Norfolk State University. His research interests include failure analysis, AI, CFD, and electrical-thermomechanical engineering.
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Park, S., Shim, HS., Lee, JS. et al. Analysis of the temperature evolution in cyclic loading using the thermoelastic effect with plastic deformation. J Mech Sci Technol 38, 221–228 (2024). https://doi.org/10.1007/s12206-023-1219-6
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DOI: https://doi.org/10.1007/s12206-023-1219-6