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A 3-prismatic-revolute-spherical compliant parallel platform for optoelectronic packaging

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Abstract

To align the optical channels of optoelectronic appliances, a 3-prismatic-revolute-spherical (3-PRS) compliant parallel platform (CPP) is proposed in this work. The platform has special large stroke compliant joints. Attention is paid to the establishment of the inverse kinematics model and the analysis of the parasitic motion (PM) of the platform. A prototype of the platform is also presented, and its accuracy is experimentally evaluated. Besides, the platform is employed as a 3 degree-of-freedom (DOF) platform for optoelectronic packaging. Furthermore, the closed-loop control strategy requires merely one optical power meter to avoid the use of complex multiple DOF detection devices. In this respect, the influence of the precision of inverse kinematics solution on the optoelectronic packaging is reduced. Moreover, a compensation rule is employed to minimize the effect of PM on the motion accuracy of the platform. The results show that the proposed 3-PRS CPP is highly efficient for optoelectronic packaging.

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Acknowledgments

This work was supported in part by the National Key Research and Development Program of China [grant numbers 2017YFB1104800] and the National Natural Science Foundation of China [grant numbers 51975590].

Author information

Authors and Affiliations

  1. State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, 410083, China

    Hongwei Xu, Haibo Zhou, Shuaixia Tan & Ji-An Duan

  2. Ningbo Fotile Kitchen Ware Company Ltd., Ningbo, 315336, China

    Zhiping Kong

Authors
  1. Hongwei Xu
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  2. Haibo Zhou
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  3. Shuaixia Tan
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  4. Zhiping Kong
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  5. Ji-An Duan
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Corresponding author

Correspondence to Haibo Zhou.

Additional information

Hongwei Xu was born in Yiyang city, Hunan Province, China in 1992. He received the M.E. degree, in 2018, in Mechanical Engineering from the School of Mechanical and Electrical Engineering, Central South University, Changsha, China, where he is currently working toward the Ph.D. degree in Mechanical Engineering. His research interests include modeling and control of electromechanical systems.

Haibo Zhou received the Ph.D. degree in Mechanical and Electrical Engineering from Central South University, Changsha, China, in 2010. Since 2017, he has been a Professor with the School of Mechanical and Electrical Engineering, Central South University. Between 2007 and 2008, he was a visiting Ph.D. student in the Department of Electrical and Computer Engineering of Wayne State University, Detroit, MI, USA. His current research interests include type-2 fuzzy systems, and modeling and control of electromechanical systems.

Shuaixia Tan was born in Yiyang city, Hunan Province, China in 1982. She received the B.S. degree in Physics from the Xiangtan University, Xiangtan, China, in 2004 and the Ph.D degree in Polymer Chemistry and Physics from Institute of Chemistry, Chinese Academy of Sciences, Beijing, China, in 2009. Her research interests include the advanced material preparation and characterization, equipment design and improvement, laboratory construction and certification.

Zhiping Kong received the B.E. degree in Mechanical Engineering from Henan Polytechnic University, Jiaozuo, China, in 2017. She received the M.E. degree in Mechanical Engineering from School of Mechanical and Electrical Engineering, Central South University, Changsha, China, in 2020. Her research interest include compliant parallel platforms.

Ji’an Duan received the Ph.D. degree in Mechanical Engineering from Xi’an Jiaotong University, Xi’an, China, in 1996. He is currently a Professor with the State Key Laboratory of High Performance Complex Manufacturing, Central South University, Changsha, China. His research interests include modeling and control of electromechanical systems, and optical devices fabrication and encapsulation. Prof. Duan is the Cheung Kong Scholars Chair Professor of China.

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Xu, H., Zhou, H., Tan, S. et al. A 3-prismatic-revolute-spherical compliant parallel platform for optoelectronic packaging. J Mech Sci Technol 36, 2685–2694 (2022). https://doi.org/10.1007/s12206-022-0502-2

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  • DOI: https://doi.org/10.1007/s12206-022-0502-2

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