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Packaging effects on the sensing performance of RTDs on an AlN substrate of a wafer heater

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Abstract

This study investigates packaging effects on the sensing performance of resistance temperature detectors (RTDs) on an AlN substrate of a wafer heater. The study utilizes a solder packaged RTD (PRTD1) as a conventional case and a thermal paste immersed RTD (PRTD2) as a traction free case with the AlN substrate. A high precision measurement study and a robust FEA thermal-structural study are conducted to explore packaging effects. The measurement finds that sensed results by the PRTD1 are even 2.5 °C or 0.9 Ω higher than those of the PRTD2. The thermally-induced strain in the Pt thin-film of the PRTD1 may explain this difference. The FEA study determines that the non-negligible axial strain of 0.002 occurs in the Pt thin-film with the heated surface of the AlN substrate isothermal at 250 °C. This study demonstrates that the straightforward analytical method may reasonably predict the shift of the electrical resistance, induced by the thermally-induced strain, of the RTD. The discrepancy is found to be smaller than 10 % compared with the sophisticated measurement.

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Abbreviations

A and B :

Temperature coefficient of the RTD

E :

Young’s modulus

e :

Elastic constant

G :

Shear modulus

GF :

Gauge factor

k :

Thermal conductivity

R :

Electrical resistance

R 0 :

RTD resistance at 0 °C

R T :

Measured electrical resistance

T :

Temperature

T R :

Converted temperature value

α :

Coefficient of thermal expansion

β :

Temperature coefficient of resistance

ε :

Strain

θ :

Temperature change

ρ :

Electrical resistivity

ν :

Poisson’s ratio

μ :

Elastic constant

σ :

Stress

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Acknowledgments

This work was supported by the Pukyong National University Research Fund in 2018.

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Authors and Affiliations

  1. Dept. of Mechanical Design Engineering, Pukyong National University, Busan, 48547, Korea

    Nico Setiawan Effendi & Kyoung Joon Kim

Authors
  1. Nico Setiawan Effendi
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  2. Kyoung Joon Kim
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Corresponding author

Correspondence to Kyoung Joon Kim.

Additional information

Nico Setiawan Effendi received his B.E. in Mechanical Engineering from Diponegoro University, Indonesia, in 2014. He received his M.Eng. and Ph.D. degrees in Mechanical Design Engineering from Pukyong National University, Korea in 2016 and 2020. His current research is the development of a thermal management system for electronics.

Kyoung Joon Kim received the B.S. degree in Mechanical Engineering from Chung-Ang University, Seoul, Korea in 1999, the M.S. degree in Mechanical Engineering from the University of Minnesota, Minneapolis, USA in 2002, and the Ph.D. degree in Mechanical Engineering from the University of Maryland, College Park, USA in 2006. He had been with Bell Laboratories, Dublin, Ireland, as a member of technical staff from 2008 to 2011. He is currently a Professor in Mechanical Design Engineering, Pukyong National University, Korea. His current research interests are thermal packaging of electronics and photonics, conjugate heat transfer with advanced extended surfaces, and multiphysics thermal design for microelectronics reliability.

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Effendi, N.S., Kim, K.J. Packaging effects on the sensing performance of RTDs on an AlN substrate of a wafer heater. J Mech Sci Technol 35, 4239–4246 (2021). https://doi.org/10.1007/s12206-021-0834-3

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  • DOI: https://doi.org/10.1007/s12206-021-0834-3

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