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Analysis of temperature distribution in the chip-on-glass bonding process

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Abstract

The chip-on-glass bonding process is one of the most effective packaging methods that can satisfy the need for thin, large, low-cost and light display panels in the liquid crystal display (LCD) industry. This process uses an anisotropic conductive film (ACF) as the adhesion layer between the driver chip and the LCD panel and is based on thermocompressing bonding. Thus, the proper temperature conditions, such as temperature level and even distribution over the film, can play the vital role in the improvement of bonding performance, quality, and reliability. A finite element analysis model for predicting temperature distributions in all the components of the process equipment as well as the driver chip, the LCD panel and the ACF is presented. The accuracy of the developed model is verified by comparing the simulated temperature distribution with the actual one. Consequently, the model is used in determining the tooltip dimension to introduce proper temperature distribution to the driver chip and the film.

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Acknowledgments

This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No. NRF-2018R1A2B2009540).

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Authors and Affiliations

  1. Department of Mechanical Engineering, Korea Polytechnic University, Gyeonggi-do, 15073, Korea

    Won-Soo Yun & Songwan Jin

  2. KohYoung Technology Inc., Seoul, 08588, Korea

    Seung Won Jung

  3. School of Mechanical Engineering, Kyungpook National University, Daegu, 41566, Korea

    Young Hun Jeong

Authors
  1. Won-Soo Yun
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  2. Seung Won Jung
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  3. Songwan Jin
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  4. Young Hun Jeong
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Corresponding author

Correspondence to Young Hun Jeong.

Additional information

Recommended by Editor Hyung Wook Park

Won-Soo Yun is a Professor of the Department of Mechanical Engineering, Korea Polytechnic University, Siheung, Korea. He received his Ph.D. in Mechanical Engineering from POSTECH. His research interests include 3D bio-printing and tissue engineering.

Seung Won Jung is a Deputy General Manager of Inspection System Vision Department, KohYoung Technology, INC. Gyeonggi, Korea. He received his M.S. degree in Mechanical Engineering from Korea Polytechnic University. His research interests include vision system and software and hardware development.

Songwan Jin is a Professor of the Department of Mechanical Engineering, Korea Polytechnic University, Siheung, Korea. He received his Ph.D. in Mechanical and Aerospace Engineering from Seoul National University. His research interests include 3D bioprinting and microfluidics.

Young Hun Jeong is an Associate Professor of the School of Mechanical Engineering, Kyungpook National University, Daegu, Korea. He received his Ph.D. in Mechanical Engineering from POSTECH. His research interests include nano/micro manufacturing and biomaterials.

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Yun, WS., Jung, S.W., Jin, S. et al. Analysis of temperature distribution in the chip-on-glass bonding process. J Mech Sci Technol 34, 3041–3047 (2020). https://doi.org/10.1007/s12206-020-0635-0

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  • DOI: https://doi.org/10.1007/s12206-020-0635-0

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