Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication
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This paper demonstrates the fabrication process of precision machining tools from polycrystalline diamond (PCD) attached on tungsten carbide (WC) tips and WC shanks via diffusion bonding with a nickel alloy filler metal. The join was investigated using micro X-ray computed tomography (micro-CT), and the strength of the bond was measured via tensile strength tests. Diffusion bonding was carried out with various pressures and various time durations. The micro-CT results showed that the nickel alloy filler metal between the PCDWC composite tip and WC shank disappeared at higher pressures. Voids were observed if the pressure was too low or the time duration for bonding was not enough. The presence of these voids can result in insufficient bonding force of the join, and hence leads to unpredictable failure of the tool. The pressure was found to affect the properties of the bond more significantly than the bonding time. Diffusion bonding with high quality joins between PCD-WC and WC can be achieved at relatively low temperature under 1000 °C through high pressure around 24 MPa and relatively long bonding time durations.
KeywordsPCD tool Diffusion bonding Bonding layer Micro X-ray computed tomography Tensile strength test Tungsten carbide
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This research was partially supported by research fund from Chosun University 2018 and Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF-2017R1D1A1 B03031463).
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