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Reliability analysis for thermal cutting method based non-explosive separation device

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Abstract

In order to increase the reliability of a separation device for a small satellite, a new non-explosive separation device is invented. This device is activated using a thermal cutting method with a Ni-Cr wire. A reliability analysis is carried out for the proposed non-explosive separation device by applying the Fault tree analysis (FTA) method. In the FTA results for the separation device, only ten single-point failure modes are found. The reliability modeling and analysis for the device are performed considering failure of the power supply, the Ni-Cr wire burns failure and unwinds, the holder separation failure, the balls separation failure, and the pin release failure. Ultimately, the reliability of the proposed device is calculated as 0.999989 with five Ni-Cr wire coils.

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Authors and Affiliations

  1. Department of Aerospace and Mechanical Engineering, Graduate School, Korea Aerospace University, Goyang-si, Gyeonggi-do, Korea

    Junwoo Choi & Kukha Hwang

  2. School of Aerospace and Mechanical Engineering, Korea Aerospace University, Goyang-si, Gyeonggi-do, Korea

    Byungkyu Kim

Authors
  1. Junwoo Choi
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  2. Kukha Hwang
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  3. Byungkyu Kim
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Corresponding author

Correspondence to Byungkyu Kim.

Additional information

Recommended by Associate Editor Jin Weon Kim

Junwoo Choi received his B.S. and M.S. degrees from Korea Aerospace University, Korea, in 2013 and 2015, respectively, and is now Doctorate course in Korea Aerospace University. His major research interests include mechanical designs for deployable and locking device.

Kukha Hwang received his B.S. degree from Korea Aerospace University, Korea, in 2015, and is now Master course in Korea Aerospace University. His major research interests include mechanical designs for deployable device.

Byungkyu Kim received his Ph.D. in Mechanical Engineering from the University of Wisconsin, Madison, in 1997. From 1997 to 2000, he was a Research Associate of Center for X-ray Lithography in the University of Wisconsin. From 2000 to 2005, he worked for Microsystem Center of KIST as a Principal Research Scientist. He was in charge of developing the microrobot for a microcapsule-type endoscope. Currently, he is a Professor in the School of Aerospace and Mechanical Engineering in Korea Aerospace University. His major interests are mechanical designs and analysis for spacecraft mechanism.

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Choi, J., Hwang, K. & Kim, B. Reliability analysis for thermal cutting method based non-explosive separation device. J Mech Sci Technol 30, 5433–5438 (2016). https://doi.org/10.1007/s12206-016-1111-8

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  • DOI: https://doi.org/10.1007/s12206-016-1111-8

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