Journal of Mechanical Science and Technology

, Volume 29, Issue 6, pp 2501–2508 | Cite as

Experimental study of humidity control methods in a light-emitting diode (LED) lighting device

  • Chul-Sook Kim
  • Jin-Gyu Lee
  • Ji-Hyun Cho
  • Dong-Yeon Kim
  • Tae-Beom SeoEmail author


Light-emitting diode (LED) lights can reduce greenhouse gas emissions significantly by using electrical energy efficiently. However, the sensitive characteristics of an LED change with temperature and humidity. Humidity is directly related to performance degradation (The durability and efficiency) of electronic devices, including LED lights. Solving the problem of heating or humidity is important to ensure the reliability of an LED product. We examined commercially available humidity control methods, and experimented with MILSTD- 810G (Military Standards United States) to evaluate humidity on the global climatic environment. As a result, even though an LED light satisfies the IP66 grade, if it has an air vent, there is a strong possibility that condensation will occur in the lamp during a sudden change of temperature and humidity in an environment of high temperature and humidity. Because methods of using heat pipes and fans increase the dry-bulb temperature, the relative humidity (RH) decreases slightly. In the case of the thermoelement method, when the thermoelement was working, the humidity ratio was about 0.0185. When it was not working, the humidity ratio was about 0.0215. In the case of the absorbent method, when absorbent was in the lamp, the humidity ratio was about 0.008. Comparing two tests, the water vapor in the air decreased by 64%.


Degradation Humidity control Light-emitting diode (LED) Moisture diffusion 


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  1. [1]
    T. Dong, An analysis of heat transfer in LED luminaires, Doctorate Thesis, RPI, USA (2010) 1–3.Google Scholar
  2. [2]
    N. Narendran and Y. Gu, Life of LED-based white light sources, IEEE/OSA JDT, 1 (1) (2005) 167–170.Google Scholar
  3. [3]
    N. Narendran, Y. Gu, J.P. Freyssinier, H. Yu and L. Deng, Solid-state lighting: failure analysis of white LEDs, Journal of Crystal Growth, 268 (2004) 449–456.CrossRefGoogle Scholar
  4. [4]
    N. Narendran, Y. Gu and R. Hosseinzadeh, Estimating junction temperature of high-flux white LEDs, Proc. of SPIE — The International society for optical engineering, USA (2004) 158–160.Google Scholar
  5. [5]
    US Air Force Avionics Integrity Program.Google Scholar
  6. [6]
    M. Arik, C. Becker, S. Weaver and J. Petroski, Thermal management of LEDs: package to system, Proc. of SPIE — Third International conference on solid state lighting, USA (2003) 64–75.Google Scholar
  7. [7]
    Y. Deng and J. Liu, A liquid metal cooling system for the thermal management of high power LEDs, International Communications in Heat and Mass Transfer, 37 (2010) 788–791.CrossRefGoogle Scholar
  8. [8]
    X. Luo and S. Liu, A microjet array cooling system for thermal management of high-brightness LEDs, IEEE Transactions on Advanced Packaging, 30 (3) (2007) 475–484.CrossRefGoogle Scholar
  9. [9]
    I. Kim, S. E. Cho, D. Y. Jung, C. R. Lee, D. S. Kim and B. J. Baek, Thermal analysis of high power LEDs on the MCPCB, JMST, 27 (5) (2013) 1493–1499.Google Scholar
  10. [10]
    X. Luo, B. Wu and S. Liu, Effects of moist environments on LED module reliability, IEEE Transactions on Device and Materials Reliability, 10 (2) (2010) 182–186.MathSciNetCrossRefGoogle Scholar
  11. [11]
    C. M. Tan, B. K. E. Chen, G. Xu and Y. Liu, Analysis of humidity effects on the degradation of high-power white LEDs, Microelectronics Reliability, 49 (2009) 1226–1230.CrossRefGoogle Scholar
  12. [12]
    J. Z. Hu, L. Q. Yang and M. W. Shin, Mechanism and thermal effect of delamination in high-emitting diode packages, Microelectronics Journal, 38 (2) (2007) 157–163.CrossRefGoogle Scholar
  13. [13]
    IPC/JEDEC J-STD-020D, Moisture/reflow sensitivity classification for nonhermetic solid state surface mount device (2007) 1–13.Google Scholar
  14. [14]
    L. Zhigang, Y. Guozheng and S. Xuefeng, Elasto-plastic analysis of popcorn failure caused by cavitation unstable growth in plastic IC packaging material, 11th International Conference on Electronic Packaging Technology & High Density Packaging, China (2010) 1073–1076.Google Scholar
  15. [15]
    Department of defense, USA, Environmental engineering considerations and laboratory tests, MIL-STD-810G part one (2008) 1–25.Google Scholar
  16. [16]
    Department of defense, USA, Environmental engineering considerations and laboratory tests, MIL-STD-810G Method 507.5 (2008) 1–20.Google Scholar
  17. [17]
    H. R. Byers, H. Moses and P. J. Harney, Measurement of rain temperature, J. of Meteorology, 6 (1949) 51–55.CrossRefGoogle Scholar

Copyright information

© The Korean Society of Mechanical Engineers and Springer-Verlag Berlin Heidelberg 2015

Authors and Affiliations

  • Chul-Sook Kim
    • 1
  • Jin-Gyu Lee
    • 1
  • Ji-Hyun Cho
    • 1
  • Dong-Yeon Kim
    • 1
  • Tae-Beom Seo
    • 2
    Email author
  1. 1.Department of Mechanical Engineering, Graduate schoolInha UniversityIncheonKorea
  2. 2.Department of Mechanical EngineeringInha UniversityIncheonKorea

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