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Process chain analysis of the dimensional integrity in a metal-insert polymer smart phone baseplate — from die casting to polymer injection molding

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Abstract

Given the rapid development of die casting and polymer injection molding technologies, injection molding with metal-insert products, such as smart phone baseplate, can be widely produced and used. Injection molding usually has a complicated shape and high precision. Residual stress and related warping, local bending, and shrinkage are the key problems that affect the final product quality. These defects are generated because of temperature change, pressure, and cooling regime. In this research, finite element method was carried out to process chain analysis from die casting to polymer injection molding. This method predicted the residual stresses during the packing and cooling stages of die casting and polymer injection molding. The reason of distortion after ejection as well as the magnitude and distribution of distortion were also analyzed. To verify the calculated distortion after ejection, we compared the numerical analysis results with the experimental results that were measured by 3D scanning technology. The calculated deformation was consistent, and the residual stress was formed because of the different thicknesses of the sheets that resulted in different cooling rates, causing thermal stresses to become unevenly distributed. After the ejection, the uneven residual stress caused local distortion.

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Authors and Affiliations

  1. School of Mechanical Engineering, Sogang University, Seoul, 121-742, Korea

    Kai Jin, Taesan Kim & Naksoo Kim

  2. Production Engineering Research Institute, LG Electronics, 222, LG-ro, Jinwi-myeon, Pyeongtaek-si, Gyeonggi-do, 451-713, Korea

    Byeonggon Kim

Authors
  1. Kai Jin
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  2. Taesan Kim
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  3. Naksoo Kim
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  4. Byeonggon Kim
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Corresponding author

Correspondence to Naksoo Kim.

Additional information

Recommended by Associate Editor Youngseog Lee

Kai Jin earned his B.S. degree from the School of Automotive Engineering, Harbin Institute of Technology, Weihai, China in 2010. He is currently studying at Sogang University, Seoul, South Korea to receive his Ph.D. degree from the Department of Mechanical Engineering in 2015. His research interests are die casting and injection molding process analysis.

Naksoo Kim is currently a professor at the Department of Mechanical Engineering, Sogang University, Seoul, South Korea. He received his B.S. and M.S. degrees from the Department of Mechanical Design, Seoul National University, Seoul, South Korea in 1982 and 1984, respectively. He then went on to receive his Ph.D. from UC Berkeley, California, USA. Dr. Kim has worked for the Engineering Research Center for Net Shape Manufacturing at Ohio State University as a senior researcher and at Hongik University as an assistant professor. Dr. Kim’s research interests are metal forming plasticity, computer-aided process analysis, and optimal design.

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Jin, K., Kim, T., Kim, N. et al. Process chain analysis of the dimensional integrity in a metal-insert polymer smart phone baseplate — from die casting to polymer injection molding. J Mech Sci Technol 29, 1703–1713 (2015). https://doi.org/10.1007/s12206-015-0343-3

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  • DOI: https://doi.org/10.1007/s12206-015-0343-3

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