A thermal simulation of the DDI development of a multi-channel package for high-definition LCD panels

Abstract

A multi-channel display driver integrated circuit (DDI), which is the core part of a liquid crystal display (LCD) television (TV), was proposed. The introduction of multi-channel DDIs in LCD TVs results in thermal problems because of increased power in LCD TVs. DDIs are investigated at package and module levels to solve this thermal problem, and extracting the junction temperature (T _j ) of DDI at a system level is also necessary. The objectives of this research are as follows. First, a standard temperature-measurement environment that is centered on consumers should be defined. Second, the defined measurement method needs to generalize analysis models (Ushaped compact model) based on the size in inches of LCD modules. Third, a cooling method based on multi-channel DDI needs to be proposed. Afterward, the effect of the proposal needs to be verified. The contributions of this study to the development of DDI products are as follows: first, this study performs heat dissipation parameters in multi-channel DDIs by using a generalized compact model. When the compact model is used, it can easily handle boundary conditions and accurately predict the temperature. Consequently, the temperature in the DDI can be calculated easily at a system level. We also propose a cooling plan to protect DDIs from overheating. This cooling plan can be utilized in the DDI design. Second, the thermal problem in conventional chip on films (CoF), which is caused by increased power, is solved by proposing a thermally enhanced CoF (TECoF), thereby reducing costs because of the reduced number of DDIs. For reference, an international patent is applied for the TECoF. Third, an estimated equation of Y (DDI temperature) for X’s is used in a package development system to predict the temperature in the early stage of the development and to prepare various countermeasures.