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Fabrication and Performance Investigation of Karma Alloy Thin Film Strain Gauge


Karma alloy thin film strain gauges were fabricated on alumina substrates by magnetron sputtering. The electrical properties of strain gauges annealed at different temperatures were then tested. The surface morphology and phase structure of the Karma alloy thin films were analyzed using X-ray diffraction and scanning electron microscopy. The effect of the annealing temperature on the performance of the Karma alloy thin film strain gauge was also investigated. As the annealing temperature increased, it was found that the resistivity of the thin films decreased, whereas the temperature coefficient of resistance (TCR) of the thin films increased. A Karma alloy thin film strain gauge was annealed at 200 °C, thereby obtaining a gauge factor of 1.7 and a corresponding TCR of 64.8 × 10−6 K−1. The prepared Karma alloy thin film strain gauge had a lower TCR than other strain gauges at room temperature. This result can provide a reference for the preparation and application of Karma alloy thin film strain gauges in specific scenarios.

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Correspondence to Congchun Zhang.

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Lei, P., Zhang, C., Pang, Y. et al. Fabrication and Performance Investigation of Karma Alloy Thin Film Strain Gauge. J. Shanghai Jiaotong Univ. (Sci.) 26, 454–462 (2021).

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Key words

  • thin film strain gauge
  • Karma alloy
  • magnetron sputtering
  • coefficient of resistance (TCR)
  • gauge factor

CLC number

  • TP 212