Abstract
A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the void are described, which gives some insight into the reliability of the interconnect under combined thermal and mechanical loads.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
Wang H, Li Z. The instability of the diffusion-controlled grain-boundary void in stressed solid [J]. Acta Mechanica Sinica, 2003, 19: 330–339.
Wang H, Li Z. Stability and shrinkage of a cavity in stressed grain [J]. Journal of Applied Physics, 2004, 95(11): 6025–6031.
Ru C Q. Thermomigration as a driving force for instability of electromigration induced masstransport in interconnect lines [J]. J Mater Sci, 2000, 35: 5575–5579.
Wang D F, He PF, LiuZ S. Structural intensity characterization of composite laminates subjected to impact load [J]. J Shanghai Jiaotong Univ (Sci), 2008, 13(3): 375–380.
Ru C Q. Intrinsic instability of electromigration induced mass transport in a two-dimensional conductor [J]. Acta mater, 1999, 47(13): 3571–3578.
McCartney L N. Cavities under stress at high temperatures [J]. Acta Metall, 1997, 25: 221–230.
Gao H. Stress analysis of holes in anisotropic elastic solids: conformal mapping and boundary perturbation [J]. Mech Appl Math, 1992, 45: 149–168.
Gao H. The hypocycloid cavity: A path from a Griffith slit crack to a cusped cycloid surface [J]. Proc Roy Soc Lond, 1995, 448: 465–483.
Yu H H, Suo Z. An axisymmetric model of pore-grain boundary separation [J]. J Mech Phys Solid, 1999, 47: 1131–1155.
Wang H, Li Z. Diffusive shrinkage of a void within a grain of a stressed polycrystal [J]. Journal of the Mechanics and Physics of Solids, 2003, 51: 961–976.
Rice J R, Chuang Tze-Jer. Energy variations in diffusive cavity growth [J]. J Am Ceram Soc, 1981, 64:46–53.
Speight M V, Beere W. Vacancy potential and void growth on grain boundaries [J]. Met Sci, 1975, 9: 190–191.
Takahashi T, Inoue K. Recent void shrinkage models and their applicability to diffusion bonding [J]. Mater Sci Technol, 1992, 8: 953–964.
Takahashi T, Ueno F, Nishiguchi K. A numerical analysis of the void shrinkage process controlled by surface-diffusion [J]. Acta Metall, 1988, 36: 3007–3018.
Wang H, Li Z. The three-dimensional analysis for diffusive shrinkage of a grain-boundary void in stressed solid [J]. Journal of Materials Science, 2004, 39: 3425–3432.
Suo Z, Wang W. Diffusive void bifurcation in stressed solid [J]. J Appl Phys, 1994, 76(6): 3410–3421.
Author information
Authors and Affiliations
Corresponding author
Additional information
Foundation item: the National Natural Science Foundation of China (Nos. 10602034, 10572088)
Rights and permissions
About this article
Cite this article
Li, El., Chen, X., Wang, H. et al. Morphological evolution of a void under thermal and mechanical loads. J. Shanghai Jiaotong Univ. (Sci.) 14, 69–72 (2009). https://doi.org/10.1007/s12204-009-0069-4
Received:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12204-009-0069-4