Frontiers of Optoelectronics

, Volume 9, Issue 4, pp 585–591 | Cite as

Water cooling radiator for solid state power supply in fast-axial-flow CO2 laser

  • Heng Zhao
  • Bo Li
  • Wenjin Wang
  • Yi Hu
  • Youqing Wang
Research Article


Two different flow channel configurations on thermal resistances associated with the behavior of cooling of power device were studied in this paper. ANSYS Icepak 14.0 has been adopted as a numerical simulation tool. The simulation results from this study showed that the shapes of channels in cooling radiator play an important role in the thermal management of water cooling radiation system. The optimal channel design could improve the heatdissipating efficiency by 80% in water cooling radiation system. The result also indicated that the thermal resistance of heat sinks decreased with the volumetric flow rate and the number of cylindrical columns in the flow channel. Experimental results were obtained under certain channel configurations and volume rates. Moreover, the results of numerical simulation can be explained well by the experimental results.


heat spreader water cooling turbulence generator Icepak software 


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    Sublemontier O, Lacour F, Leconte Y, Herlin-Boime N, Reynaud C. CO2 laser-driven pyrolysis synthesis of silicon nanocrystals and applications. Journal of Alloys and Compounds, 2009, 483(1–2): 499–502CrossRefGoogle Scholar
  2. 2.
    Kawashima Y. Proposal of a synchrotron radiation facility to supply ultraviolet light, X-ray, MeV-Photon, GeV-photon and neutron. In: Proceedings of FLS. 2006, WG112Google Scholar
  3. 3.
    Hoshino H, Suganuma T, Asayama T, Nowak K, Moriya M, Abe T, Endo A, Sumitani A. LPP EUV light source employing high-power CO2 laser. Proceedings on Advanced Lithography Technologies, 2008, 6921: 692131CrossRefGoogle Scholar
  4. 4.
    Banna S, Berezovsky V, Schächter L. Particle acceleration by stimulated emission of radiation: theory and experiment. Physical Review E: Statistical, Nonlinear, and Soft Matter Physics, 2006, 74 (4 Pt 2): 046501–046514CrossRefGoogle Scholar
  5. 5.
    Radivojevic Z, Andersson K, Bielen J A, van der Wel P J, Rantala J. Operating limits for RF power amplifiers at high junction temperatures. Microelectronics and Reliability, 2004, 44(6): 963–972CrossRefGoogle Scholar
  6. 6.
    Van Wyk J D, Lee F C. Power electronics technology at the dawn of the new millennium-status and future. In: Proceedings of IEEE Power Electronics Specialists Conference. 1999, 1: 3–12Google Scholar
  7. 7.
    Bar-Cohen A, Iyengar M. Design and optimization of air-cooled heat sinks for sustainable development. IEEE Transactions on Components and Packaging Technologies, 2002, 25(4): 584–591CrossRefGoogle Scholar
  8. 8.
    Ozturk E, Tari I. Forced air cooling of CPUs with heat sinks: a numerical study. IEEE Transactions on Components and Packaging Technologies, 2008, 31(3): 650–660CrossRefGoogle Scholar
  9. 9.
    Zhang H, Liu J J, Li Y, Yao S C. Porous media modeling of twophase micro-channel cooling of electronic chips with non-uniform power distribution. In: Proceedings of the American Society of Mechanical Engineers. 2013, 64481–64491Google Scholar
  10. 10.
    Lee T. Design optimization of an integrated liquid-cooled IGBT power module using CFD technique. IEEE Transactions on Components and Packaging Technologies, 2000, 23(1): 55–60CrossRefGoogle Scholar
  11. 11.
    Moores K A, Joshi Y K, Schiroky G H. Thermal characterization of a liquid cooled AlSiC base plate with integral pin fins. IEEE Transactions on Components and Packaging Technologies, 2001, 24(2): 213–219CrossRefGoogle Scholar
  12. 12.
    Zhao D, Tan G. A review of thermoelectric cooling: Materials, modeling and applications. Applied Thermal Engineering, 2014, 66 (S1–2): 15–24CrossRefGoogle Scholar
  13. 13.
    Yakhot V, Orszag S A. Renormalization group analysis of turbulence. I. Basic theory. Journal of Scientific Computing, 1986, 1(1): 3–51MathSciNetCrossRefzbMATHGoogle Scholar
  14. 14.
    Patankar S V. Numerical Heat Transfer and Fluid Flow. New York: Hemisphere Publishing Corporation, 1980, 36–78zbMATHGoogle Scholar
  15. 15.
    Versteeg H K, Malasekera W. An Introduction to Computational Fluid Dynamics (The Finite Volume Method). London: Addison Wesley Longman Limited, 1995, 57–89Google Scholar
  16. 16.
    Hasan M I. Investigation of flow and heat transfer characteristics in micro pin fin heat sink with nanofluid. Applied Thermal Engineering, 2014, 63(2): 598–607CrossRefGoogle Scholar
  17. 17.
    Yu X, Feng J, Feng Q, Wang Q. Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink. Applied Thermal Engineering, 2005, 25(2–3): 173–182CrossRefGoogle Scholar
  18. 18.
    Microsemi. User Manual for DRF 1201 1, 2009Google Scholar

Copyright information

© Higher Education Press and Springer-Verlag Berlin Heidelberg 2016

Authors and Affiliations

  • Heng Zhao
    • 1
  • Bo Li
    • 1
  • Wenjin Wang
    • 1
  • Yi Hu
    • 1
  • Youqing Wang
    • 1
  1. 1.National Engineering Research Center for Laser Processing, School of Optical and Electronic InformationHuazhong University of Science and TechnologyWuhanChina

Personalised recommendations