Abstract
Designing a typical microcircuit for multi-core chips includes the development of the overall system architecture as well as the creation of single-chip multiprocessor systems, which house a set of interrelated nodes. To evaluate the complexity and power consumption of these multiprocessor systems, adequate models and methods are required. A simplified model for calculating heat dissipation in conductors suits this purpose completely. The preliminary settlement of the heat dissipation parameter will allow engineers to evaluate the on-chip interconnect topology at the early stages of design so that these interconnects comply with the power dissipation and the power consumption variables. The novelty of this approach lies in the fact that it allows modeling thermal stresses that take place inside the chip. A solver applied here enables numerical solution to differential equations that is theoretically best, i.e., a direct numerical solution. In addition, it overcame the Gibbs phenomenon by incorporating more natural, not sharp boundary conditions into the model. Here, this approach was applied to the multiprocessor system design that implies the integration of processor cores in a single chip package.
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10 July 2023
This article has been retracted. Please see the Retraction Notice for more detail: https://doi.org/10.1007/s12065-023-00865-9
References
Garimella SV, Fleischer AS, Murthy JY et al (2008) Thermal challenges in next-generation electronic systems. IEEE Trans Compon Packag Technol 31(4):801–815
Osonoe K, Aoki M, Mochizuki A et al (2017) Thermal stress analysis under thermal cycling test for SiC power device heat dissipation structures using Ag sintered layer. In: 2017 international conference on electronics packaging (ICEP). IEEE, pp 544–548
Ghimire P (2015) Real time monitoring and wear out of power modules. Department of Energy Technology, Aalborg University
Asai T, Aoki M, Mochizuki A et al (2015) Stress and strain analysis using multi-physics solver for power device heat dissipation structures under thermal cycling test. In: 2015 international conference on electronics packaging and iMAPS all Asia conference (ICEP-IAAC). IEEE, pp 818–821
Zhou B, Qi X (2011) Static thermal resistance test and simulation analysis technology for hybrid microcircuit. In 2011 international symposium on advanced packaging materials (APM). IEEE, pp 394–398
Morrison M, Hastings C, Mischo K (2015) Hands-on start to wolfram mathematica. IWU Authors Bookshelf
Xu JZ, Gao BZ, Kang FY (2016) A reconstruction of Maxwell model for effective thermal conductivity of composite materials. Appl Therm Eng 102:972–979
Fihtengoltz GM (1966) The course of differential and integral calculus. Nauka Publishing House, Moscow
Gibanov NS, Sheremet M (2018) Numerical simulation of convective-radiative heat transfer in a square cavity having local triangular heat-generating source. In ICTEA: international conference on thermal engineering
Chang X, Ma Z, Yang Y et al (2016) Bi-level semantic representation analysis for multimedia event detection. IEEE Trans Cybern 47:1180–1197
Bulat MP, Bulat PV (2013) The history of the gas bearings theory development. World Appl Sci J 27:893–897
Park SJ, Jang D, Yook SJ et al (2015) Optimization of a staggered pin-fin for a radial heat sink under free convection. Int J Heat Mass Transf 87:184–188
Li Z, Nie F, Chang X, Yang Y (2017) Beyond trace ratio: weighted harmonic mean of trace ratios for multiclass discriminant analysis. IEEE Trans Knowl Data Eng 29:2100–2110
Wang Y, Cen J, Jiang F et al (2017) Heat dissipation of high-power light emitting diode chip on board by a novel flat plate heat pipe. Appl Therm Eng 123:19–28
Zaretabar M, Asadian H, Ganji DD (2018) Numerical simulation of heat sink cooling in the mainboard chip of a computer with temperature dependent thermal conductivity. Appl Therm Eng 130:1450–1459
Altman DH, Gupta A, Tyhach M (2015) Development of a diamond microfluidics-based intra-chip cooling technology for GaN. In ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems collocated with the ASME 2015 13th international conference on nanochannels, microchannels, and minichannels, American Society of Mechanical Engineers Digital Collection
Tapaninen O, Myöhänen P, Majanen M et al (2016) Optical and thermal simulation chain for LED package. In 2016 17th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE). IEEE, pp 1–6
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Gura, D., Mikhaylov, A., Glushkov, S. et al. RETRACTED ARTICLE: Model for estimating power dissipation along the interconnect length in single on-chip topology. Evol. Intel. 15, 2369–2373 (2022). https://doi.org/10.1007/s12065-020-00407-7
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DOI: https://doi.org/10.1007/s12065-020-00407-7