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On the stability of delamination growth at scratching of thin film structures

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Abstract

Scratching of thin film/substrate structures is studied theoretically and numerically. The results are discussed in connection to delamination initiation and in particular subsequent growth at scratching. The material behavior of the film is described by classical elastoplasticity accounting for large deformations. The deformation of the substrate is neglected indicating that the results are pertinent to soft thin films. The numerical investigation is performed using the finite element method (FEM) and the numerical strategy is discussed in some detail. The results from this study show that delamination growth at thin film scratching is a stable feature with crack arrest occurring at a decreasing load.

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Acknowledgments

The authors want to acknowledge the support through grant 621-2005-5803 from the Swedish Research Council.

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Authors and Affiliations

  1. Department of Solid Mechanics, Royal Institute of Technology, 10044, Stockholm, Sweden

    Fredrik Wredenberg & Per-Lennart Larsson

  2. Swerea Kimab AB, 10216, Stockholm, Sweden

    Fredrik Wredenberg

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  1. Fredrik Wredenberg
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  2. Per-Lennart Larsson
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Correspondence to Per-Lennart Larsson.

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Wredenberg, F., Larsson, PL. On the stability of delamination growth at scratching of thin film structures. J Coat Technol Res 8, 707–717 (2011). https://doi.org/10.1007/s11998-011-9352-z

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