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He is the advisor to JOM from the TMS Electronic Packaging and Interconnection Materials Committee of the Electronic, Magnetic, & Photonic Materials Division.
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Jin, S. Advances in thermal management materials for electronic applications. JOM 50, 46 (1998). https://doi.org/10.1007/s11837-998-0127-7
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DOI: https://doi.org/10.1007/s11837-998-0127-7