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A Cu-Ni-Ti Alloy with Excellent Softening Resistance Combined with Considerable Hardness and Electrical Conductivity Obtained by the Traditional Aging Process

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Abstract

To obtain a copper alloy with a higher softening temperature, a Cu-Ni-Ti alloy was obtained by the traditional smelting method. And, on this basis, we discuss the effects of atom percentages of different Ni-Ti alloys and the mass percent of Ni + Ti on the properties of single-stage aging of Cu-Ni-Ti alloys at 600°C. The results indicate that the alloy with a Ni/Ti atomic ratio of 2 and a total Ni + Ti content of 3 wt.% exhibits the best performance match. After aging at 600°C for 8 h, the Cu-Ni-Ti alloy’s softening temperature exceeded 720°C. This property surpasses that of most age-hardened copper alloys. The corresponding hardness and conductivity were 171 HV and 58% IACS, respectively, which is slightly lower than the commonly used time-reinforced copper alloy. After calculation, the Cu-Ni-Ti alloy with a Ni:Ti atomic ratio of 2 and a total Ni + Ti content of 3 wt.% is referred to as the Cu-2.13Ni-0.87Ti alloy. Transmission electron microscopy observations indicated that the precipitated phase in the aged Cu-2.13Ni-0.87Ti alloy consists of dispersed nanoparticles of Ni3Ti, which have a semi-coherent interface relationship with the matrix. Upon holding the peak-aged Cu-2.13Ni-0.87Ti alloy at different temperatures for 1 h, it was noted that the precipitates exhibited significant coarsening. Furthermore, when the holding temperature surpassed 700°C, the rate of coarsening increased significantly, accompanied by a rapid decline in hardness.

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Acknowledgements

This work was supported by National Copper Smelting and Processing Engineering Technology Research Center (No. 20231ZDD0205) and the Natural Science Foundation of Jiangxi Province (No. 20225BCJ22013).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangxi University of Science and Technology, Ganzhou, 341000, Jiangxi, China

    Yu Sun, Dongdong Lv, Jinping Liu, Chengjun Guo, Shengda Guo & Jianbo Zhang

  2. National Rare Earth Function Materials Innovation Center, Ganzhou, 341100, China

    Yu Sun, Dongdong Lv, Jinping Liu, Chengjun Guo, Shengda Guo & Jianbo Zhang

  3. Jiangxi Advanced Copper Industry Research Institute, Yingtan, 335000, China

    Yu Sun, Dongdong Lv, Jinping Liu, Chengjun Guo, Shengda Guo & Jianbo Zhang

  4. Jiangxi Yaosheng Tungsten Co, Ltd, Ganzhou, 341100, China

    Shengda Guo

Authors
  1. Yu Sun
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  2. Dongdong Lv
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  3. Jinping Liu
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  4. Chengjun Guo
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  5. Shengda Guo
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  6. Jianbo Zhang
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Contributions

Yu Sun: Conceptualization, Methodology, Writing - original draft. Dongdong Lv and Jinping Liu: Data curation, investigation, conceptualization. ChengjunGuo and Shengda Guo: Investigation, Formal analysis. JianBo Zhang: Supervision, Writing—review and editing.

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Correspondence to Jianbo Zhang.

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Sun, Y., Lv, D., Liu, J. et al. A Cu-Ni-Ti Alloy with Excellent Softening Resistance Combined with Considerable Hardness and Electrical Conductivity Obtained by the Traditional Aging Process. JOM (2024). https://doi.org/10.1007/s11837-024-06665-5

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  • DOI: https://doi.org/10.1007/s11837-024-06665-5

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