Abstract
In this paper, a Cu-3.20Ni-0.61Co-0.75Si-0.19Cr-0.15 Mg (wt.%) alloy was subjected to hot compression at temperatures of 700–950°C and strain rates of 0.001–10 s−1. The constitutive equations were established using a strain-related Arrhenius model and a feed-forward artificial neural network (ANN) model. Evaluation showed that the ANN-type constitutive equation had a high Pearson correlation coefficient of 0.9997 and a low mean squared error of 2.55 MPa2; thus, it was more accurate to describe the flow behavior of the Cu-Ni-Co-Si-Cr-Mg alloy than the strain-related Arrhenius-type constitutive equation. The hot processing maps in the conditions of non-linear dissipation governed by the two constitutive equations were also established. Evaluation showed that the ANN-type hot processing maps successfully predicted unstable deformation and dynamically-recrystallized microstructure and thus had better performance than the Arrhenius-type hot processing maps. The microstructure of the Cu-Ni-Co-Si-Cr-Mg alloy after hot compression was also characterized in detail. The microstructural features were unstable deformation for the compression at 700°C and 0.001 s−1, uneven deformation for the compression at 700°C and 1 s−1, equiaxed subgrains for the compression at 950°C and 0.001 s−1 and equiaxed grains and annealing twins for the compression 950°C and 1 s−1.
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Acknowledgements
The authors acknowledge the financial support from the National Key Research and Development Program of China (Grant No. 2021YFB3700700), the Key Technologies R&D Program of Yunnan Province (Grant No. 202102AB080019-1) and the Projects of State Key Laboratory of Powder Metallurgy, Central South University, Changsha, China. The authors are also grateful for the Hunan Navi New Materials Technology and the High Performance Computing Center of Central South University.
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Ma, M., Xiao, Z., Li, Z. et al. Hot Deformation and Microstructure Evolution of a Cu-Ni-Co-Si-Cr-Mg Alloy. JOM 75, 3083–3096 (2023). https://doi.org/10.1007/s11837-023-05848-w
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DOI: https://doi.org/10.1007/s11837-023-05848-w