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A Novel Setup for In Situ Monitoring of Thermomechanically Cycled Thin Film Metallizations

  • New Developments in Nanomechanical Methods
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Abstract

A novel experimental setup is presented to thermomechanically cycle metallizations in situ and, at the same time, study the progress of gradual changes in their microstructure using scanning electron microscopy. Very high heating rates are achieved by the use of special semiconductor test devices provided with active heating. The functionality of the setup is shown by one demonstrative experiment, where line-shaped copper metallization on a silicon substrate was subjected to 12,000 thermomechanical stress cycles, characterized by heating durations of 200 µs and temperature differences of 300°C.

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Acknowledgements

This work was funded by the Austrian Research Promotion Agency (FFG, Project No. 863947).

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Author notes

  1. Sebastian Moser and Gerald Zernatto contributed equally to this work.

Authors and Affiliations

  1. KAI Kompetenzzentrum für Automobil- und Industrieelektronik GmbH, Europastrasse 8, 9524, Villach, Austria

    Sebastian Moser, Gerald Zernatto, Manuel Kleinbichler, Michael Nelhiebel & Johannes Zechner

  2. Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Jahnstrasse 12, 8700, Leoben, Austria

    Megan J. Cordill & Reinhard Pippan

  3. Department of Materials Science, Montanuniversität Leoben, Jahnstrasse 12, 8700, Leoben, Austria

    Megan J. Cordill & Reinhard Pippan

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  1. Sebastian Moser
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  2. Gerald Zernatto
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  3. Manuel Kleinbichler
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  4. Michael Nelhiebel
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  5. Johannes Zechner
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  6. Megan J. Cordill
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  7. Reinhard Pippan
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Correspondence to Sebastian Moser.

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Moser, S., Zernatto, G., Kleinbichler, M. et al. A Novel Setup for In Situ Monitoring of Thermomechanically Cycled Thin Film Metallizations. JOM 71, 3399–3406 (2019). https://doi.org/10.1007/s11837-019-03695-2

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  • DOI: https://doi.org/10.1007/s11837-019-03695-2

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